Alignment Mark Feedback Calibration for Semiconductor Overlay Accuracy

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Changes in the semiconductor process cause the optimized alignment and overlay recipe parameters to become inapplicable, affecting yield and throughput.

Innovation Solution

A semiconductor manufacturing apparatus and method that automatically adjusts alignment and overlay recipe parameters in real time based on measured position and quality data of alignment marks, using a control device to calibrate these parameters.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If alignment and overlay recipe parameters are optimized for initial process conditions, then overlay accuracy is improved, but the parameters become inapplicable when process changes occur, causing yield and throughput to decrease

Engineering Contradiction:

Improveoverlay accuracyVSAvoidparameter adaptability to process changes

Core Design Contradiction:

Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The system measures alignment mark positions and quality metrics in real-time, compares them against target values, and automatically adjusts alignment and overlay recipe parameters based on the deviations detected. This closed-loop feedback mechanism ensures parameters remain optimized despite process variations.

Inventive Principle:

Principle #23Feedback

Solution Approach 2:

The alignment and overlay system performs self-calibration by automatically detecting process drift through alignment mark measurements and adjusting its own parameters without external intervention. The system serves itself by identifying and correcting parameter deviations autonomously.

Inventive Principle:

Principle #25Self-service

2Adaptability or versatility

If manual recalibration of alignment and overlay parameters is performed after process changes, then parameter applicability is restored, but yield and throughput decrease due to process interruptions

Engineering Contradiction:

Improveparameter applicabilityVSAvoidthroughput

Core Design Contradiction:

Adaptability or versatilityVSProductivity

Solution Approach 1:

The system continuously measures alignment marks and adjusts parameters throughout the semiconductor manufacturing process without stopping production. This continuous operation maintains parameter applicability while preventing throughput degradation that would occur with manual recalibration interruptions.

Inventive Principle:

Principle #20Continuity of useful action

Solution Approach 2:

The system autonomously monitors and recalibrates alignment and overlay parameters in real-time without requiring manual intervention. This self-service capability eliminates process interruptions for parameter adjustment, maintaining both adaptability and high throughput.

Inventive Principle:

Principle #25Self-service

3Manufacturing precision

If real-time measurement and calibration of alignment marks is implemented, then overlay accuracy is maintained under process variations, but device complexity increases

Engineering Contradiction:

Improveoverlay accuracyVSAvoidmeasurement and calibration system complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The measurement system serves multiple functions: it characterizes alignment marks, measures positional deviations, evaluates quality metrics, and provides data for parameter calibration. This multi-functionality reduces the need for separate dedicated systems, managing complexity while maintaining overlay accuracy.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The system implements a feedback loop where alignment mark measurements directly drive parameter calibration decisions. This integrated feedback mechanism ensures overlay accuracy is maintained through automated adjustment, with the complexity justified by the precision benefits.

Inventive Principle:

Principle #23Feedback

4Reliability

If automated real-time parameter calibration is implemented, then yield is protected from process variations, but control system complexity increases

Engineering Contradiction:

ImproveyieldVSAvoidcontrol system complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The control system continuously monitors alignment mark quality and position, comparing measurements against specifications, and automatically adjusts alignment and overlay parameters to maintain yield. This feedback-driven automation protects yield from process variations while managing control complexity through systematic decision-making algorithms.

Inventive Principle:

Principle #23Feedback

Solution Approach 2:

The system autonomously detects yield-affecting parameter deviations and corrects them without external intervention. This self-service capability ensures continuous yield protection while avoiding the operational complexity of manual monitoring and adjustment procedures.

Inventive Principle:

Principle #25Self-service

Data Source

PatentUS20260072421A1Semiconductor manufacturing apparatus and parameter adjustment method thereof

Publication Date: 2026.03.12 WINBOND ELECTRONICS CORP

AI summary

A semiconductor manufacturing apparatus and a parameter adjustment method thereof are provided. Before a process device performs a patterning process, an alignment mark of a wafer is measured to generate position data and quality data of the alignment mark. An alignment recipe parameter used by the process device to perform the patterning process and wafer bonding and an overlay recipe parameter used by a measuring device to measure a relative position of the alignment mark of the wafer are calibrated based on the position data and the quality data.