Alignment Mark Segmentation in Semiconductor Bonding Films
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Solution Overview
Problem
The low transmittance of bonding films in semiconductor processes leads to waste and reduced usable area, as they must be cut to expose alignment marks, and the formation of alignment marks on carrier wafers is resource-intensive and time-consuming.
Innovation Solution
Forming alignment marks on a base substrate, dicing it into alignment dies, and attaching these dies to a bonding film on a second substrate for alignment, eliminating the need for repeated mask formation and reducing film cutting, thus conserving resources and area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the bonding film is cut to expose alignment marks, then the alignment mark capturing is improved, but the bonding film waste increases and usable area decreases
Solution Approach 1:
The patent divides the alignment mark structure into multiple layers: the bonding film remains intact as a continuous layer, while the alignment mark itself is structured with transparent regions and light-shielding regions. This segmentation allows the bonding film to serve dual purposes as both a bonding layer and a protective layer over the alignment marks, eliminating the need to cut the bonding film while still enabling optical capture of the alignment marks through the transparent regions.
2Measurement precision
If the bonding film is cut to expose alignment marks, then the alignment mark capturing is improved, but the usable area of carrier wafer is reduced
Solution Approach 1:
The alignment mark is segmented into transparent regions and light-shielding regions within the bonding film layer itself. The transparent regions allow optical penetration for alignment mark capture, while the light-shielding regions provide contrast. This internal segmentation eliminates the need to cut away portions of the bonding film, thereby preserving the full usable area of the carrier wafer.
3Measurement precision
If a specific mask is fabricated for each type of machine and alignment mark formation, then the alignment precision is improved, but the production cost increases
Solution Approach 1:
The patent creates a universal alignment mark structure that can be used across different semiconductor processing machines and applications. The alignment mark is formed as an integral part of the bonding film structure itself, using the bonding film's own transparent and light-shielding properties. This eliminates the need for machine-specific masks and allows the same alignment mark design to be used universally, significantly reducing production costs while maintaining alignment precision.
4Measurement precision
If alignment marks are formed on carrier wafer using mask process, then the alignment precision is improved, but the production cycle time increases
Solution Approach 1:
The patent merges the alignment mark formation process with the bonding film formation process. The alignment mark structure is created simultaneously with the bonding film deposition in a single manufacturing step, rather than as a separate subsequent step. This integration eliminates the need for additional mask fabrication and alignment mark formation steps, thereby reducing production cycle time while maintaining alignment precision through the built-in transparent and light-shielding region structure.
Data Source
AI summary
An alignment mark, a semiconductor device, and fabrication methods of the alignment mark and the semiconductor device are provided. The method includes providing a first base substrate, and forming a plurality of alignment marks on the first base substrate. The method also includes dicing the first base substrate to form a plurality of alignment dies. Each alignment die includes a diced first base substrate and at least one alignment mark diced from the plurality of alignment marks on the diced first base substrate. In addition, the method includes providing a second base substrate for aligning, and forming a bonding film on the second base substrate. Further, the method includes attaching an alignment die of the plurality of alignment dies to the bonding film on an alignment region of the second base substrate using a die attach process.