Alignment Mark Formation in Semiconductor Molding Resin
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Solution Overview
Problem
The existing methods for manufacturing semiconductor devices fail to provide a convenient alignment mechanism for the molded structure after the temporary support board is removed, as there are no alignment marks on the molding resin-sealed body, making it difficult to align the semiconductor chips and interconnection layers.
Innovation Solution
A method is introduced where an alignment mark is formed in the resin during the molding process, allowing for easy alignment of the molded structure after the support base is removed, utilizing existing alignment mechanisms for semiconductor wafers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the temporary support board is removed from the molding resin-sealed body, then the semiconductor device can be obtained, but alignment cannot be performed because there are no alignment marks on the molding resin
Solution Approach 1:
The alignment mark is formed in the molding resin before the temporary support board is removed. This preliminary action ensures that the alignment mark is preserved and available for alignment operations after support board removal, solving the problem of lost alignment information.
Solution Approach 2:
The alignment mark acts as an intermediary element between the temporary support board and the final semiconductor device. It provides a reference that survives the removal process, enabling alignment operations to be performed on the molding resin-sealed body without the support board.
2Ease of manufacture
If alignment marks are not formed in the molding resin, then the manufacturing process is simpler, but alignment of the molded structure becomes difficult after support board removal
Solution Approach 1:
The alignment mark is formed during the molding process itself, as a preliminary action that does not significantly complicate manufacturing. This mark then enables precise alignment operations later, resolving the contradiction between manufacturing simplicity and alignment precision.
3Ease of operation
If alignment marks are formed in the resin, then alignment can be performed easily after support board removal, but the molding process becomes more complex
Solution Approach 1:
The alignment mark formation is merged with the molding process, combining two functions into one operation. This reduces the overall process complexity while still providing the necessary alignment capability, as the mark is formed during resin injection rather than as a separate post-processing step.
Data Source
AI summary
There is provided a method for manufacturing a semiconductor device, including: forming an interconnection layer over a support base; mounting a plurality of semiconductor chips over the interconnection layer; molding the plurality of semiconductor chips with resin; forming an alignment mark in the resin; and obtaining a molded structure by removing the interconnection layer, the plurality of semiconductor chips and the resin from the support base after forming the alignment mark.