Alignment Marks for Automated Underfill in Package-on-Package
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Solution Overview
Problem
In the semiconductor industry, the challenge lies in accurately aligning stacked semiconductor devices during the underfill injection process, particularly in package-on-package (PoP) devices, where the similarity in appearance between components can lead to inefficient manual alignment, increasing costs and reducing efficiency.
Innovation Solution
The introduction of alignment marks formed using a laser drill, which provide enhanced contrast to facilitate automatic underfill alignment, allowing for precise positioning during the underfill injection process without significant additional processing or cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If manual alignment is used for underfill injection in package-on-package devices, then alignment can be achieved, but alignment efficiency is low and costs increase due to the similarity in appearance between components
Solution Approach 1:
The patent applies contrast enhancement techniques to create visible alignment marks on the workpiece. By modifying the optical properties (color/reflectivity) of specific regions, the alignment marks become distinguishable from surrounding structures, enabling automated vision systems to easily detect and locate them without manual intervention
Solution Approach 2:
The patent introduces alignment marks as intermediary features that mediate between the automated underfill injection system and the workpiece. These marks serve as a communication interface that allows the automated system to accurately locate and align with the workpiece features without requiring complex image processing of the entire structure
2Productivity
If automated underfill alignment is implemented, then alignment speed and efficiency improve, but additional alignment marks and processing are required
Solution Approach 1:
The patent merges the alignment mark formation process with existing manufacturing steps. By integrating alignment mark creation into the molding or packaging process that is already being performed, the system achieves automated alignment capability without adding separate, complex manufacturing steps
Solution Approach 2:
The alignment marks are designed to serve multiple functions: they provide alignment references for automated vision systems, maintain structural integrity of the workpiece, and can be integrated with existing packaging features. This multi-functionality reduces the need for separate alignment-specific components and processing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient and automated underfill alignment, reducing manual intervention and associated costs while ensuring accurate placement, thereby enhancing the efficiency and reliability of the semiconductor packaging process.
Implementation Method 1
alignment marks formed using a laser drill
Data Source
AI summary
Packages having alignment marks and methods of forming the same are provided. A first workpiece is attached to a second workpiece. The first workpiece has an alignment mark. Underfill is deposited at a location adjacent to the first workpiece. The location of underfill deposition is based at least in part on the alignment mark. The underfill is also cured.