Alignment Target Overlying Circuit Layer
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Solution Overview
Problem
Existing circuit dies face challenges in achieving precise alignment and orientation during assembly due to interference from alignment targets with electrical transmission routings, limiting the density and compactness of circuit layouts.
Innovation Solution
The alignment target is positioned overlying the outermost circuit layer, rather than within it, allowing for higher density electrical transmission routings and maintaining the size of the alignment target for detection, using microfabrication and micromachining processes on substrates like silicon wafers, with distinct shapes and materials for optical contrast.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the alignment target is positioned within the circuit layer, then it provides precise alignment capability, but it interferes with the layout of electrical transmission routings and reduces circuit density
Solution Approach 1:
The alignment target is repositioned from the traditional planar location within the circuit layer to a vertical position overlying the outermost circuit layer. This dimensional transition allows the alignment target to occupy the vertical space above the circuit layer rather than competing for lateral space within the circuit layer, thereby resolving the conflict between alignment precision and circuit routing density.
2Measurement precision
If the alignment target size is increased for better detection, then detection accuracy improves, but it occupies more valuable space within the circuit layer
Solution Approach 1:
By moving the alignment target to the vertical dimension overlying the circuit layer, the patent decouples the relationship between target size and circuit space occupation. The alignment target can be made sufficiently large for accurate optical detection without encroaching on the lateral space required for circuit routings, as it now occupies the vertical space above the circuit layer.
3Area of moving object
If the circuit die is made more compact with higher routing density, then device size reduces, but alignment target placement becomes more constrained
Solution Approach 1:
The patent resolves the placement constraint by transitioning the alignment target to the vertical dimension overlying the outermost circuit layer. This dimensional change provides a dedicated placement zone that does not compete with the increasingly dense circuit routings, allowing compact circuit die design without compromising alignment target placement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables more compact and densely packed circuit dies with precise alignment capabilities, facilitating smaller designs while maintaining accurate detection and interaction with external sensors.
Implementation Method 1
The alignment target is provided with a distinct shape and material that provides an alignment target contrast to an external sensor
Data Source
AI summary
A circuit die may include an outermost circuit layer having electrical transmission routing and an alignment target overlying the outermost circuit layer.