AlInN Buffer Layer Lattice Control for GaN Crystallinity

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Solution Overview

Problem

Existing methods for growing Group III nitride semiconductor crystals on substrates like sapphire and SiC face challenges due to large lattice mismatch, leading to poor crystallinity and light emission efficiency, with existing buffer layers not effectively addressing dislocation issues and productivity concerns.

Innovation Solution

A Group III nitride semiconductor device with a buffer layer made of AlN, where the lattice constants are controlled to satisfy a specific relationship, ensuring good orientation and uniformity, and a ground layer of GaN is formed using an MOCVD method, resulting in improved crystallinity and light-emitting properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a low temperature buffer layer made of AlN or AlGaN is laminated on a substrate to enable epitaxial growth, then the crystal can be grown on the substrate, but the lattice match is not achieved and threading dislocations are generated

Engineering Contradiction:
Improvecrystal growth capabilityVSAvoidlattice matching
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The invention changes the composition parameters of the buffer layer by introducing InN into AlN to form an AlInN buffer layer. By adjusting the In composition ratio, the lattice constant of the buffer layer is modified to achieve better lattice matching with both the sapphire substrate and the GaN crystal layer, thereby reducing threading dislocations while maintaining crystal growth capability

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The invention creates a composite buffer layer structure consisting of AlInN with specific composition ratios. This composite material combines the advantages of AlN (good lattice matching with sapphire) and InN (good lattice matching with GaN), enabling simultaneous optimization of interface matching at both substrate and crystal interfaces

Inventive Principle:
Principle #40Composite materials

2Stability of the object's composition

If a buffer layer is formed by high frequency sputtering to achieve stable crystal lamination, then crystal stability improves, but the crystallinity of the (10-10) plane of the GaN ground layer remains poor

Engineering Contradiction:
Improvecrystal lamination stabilityVSAvoidcrystallinity of (10-10) plane
Core Design Contradiction:
Stability of the object's compositionVSManufacturing precision

Solution Approach 1:

The invention optimizes the composition parameters of the AlInN buffer layer by controlling the In content within specific ranges (0.01≤x≤0.20 in Al1-xInxN). This parameter optimization simultaneously improves both the stability of crystal lamination and the crystallinity of the GaN (10-10) plane by achieving better lattice matching without excessive lattice constant deviation

Inventive Principle:
Principle #35Parameter changes

3Manufacturing precision

If the lattice constant of the buffer layer is reduced to improve orientation, then the uniformity of the buffer layer improves, but the dislocation density increases

Engineering Contradiction:
Improvebuffer layer uniformityVSAvoiddislocation density
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The invention optimizes the In composition ratio in the AlInN buffer layer to achieve the optimal balance between lattice constant and dislocation density. By controlling x within 0.01≤x≤0.20, the lattice constant is reduced sufficiently to improve orientation and uniformity, while avoiding excessive reduction that would cause misfit dislocations

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The approach results in a Group III nitride semiconductor with enhanced device properties and light-emitting performance by achieving better lattice matching and reducing dislocation density, thereby improving the overall quality of the semiconductor layer.

Implementation Method 1

the buffer layer is formed by using plasma to activate and react a Group V element-containing gas and a metal material

Methodology Applied
Scientific EffectPlasma: Plasma

Implementation Method 2

a vapor of a raw material is introduced into a carrier gas to convey the vapor to the surface of a substrate and decompose the raw material on the surface of the heated substrate, to thereby grow a crystal

Methodology Applied
Scientific EffectChemical Vapour Deposition: Chemical Vapour Deposition

Data Source

PatentEP2273536B1Group iii nitride semiconductor device and method for manufacturing the same, group iii nitride semiconductor light-emitting device and method for manufacturing the same, and lamp
Publication Date: 2013.10.30 TOYODA GOSEI CO LTD
  • EP2273536B1 patent drawingFigure 1
  • EP2273536B1 patent drawingFigure 2~3
  • EP2273536B1 patent drawingFigure 4

AI summary

A Group III nitride semiconductor device of the present invention is obtained by laminating at least a buffer layer (12) made of a Group III nitride compound on a substrate (11), wherein the buffer layer (12) is made of AlN, and a lattice constant of a-axis of the buffer layer (12) is smaller than a lattice constant of a-axis of AlN in a bulk state.