Aliphatic Ring Resin for Deep UV Lithography Resolution
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Solution Overview
Problem
Conventional chemically-amplified resins used in microfabrication face challenges such as poor resolution, trapezoidal resist pattern profiles due to absorption of deep ultraviolet rays by aromatic rings, insufficient dry etching resistance, and temperature-dependent line width fluctuations, which hinder the miniaturization of integrated circuit devices.
Innovation Solution
A radiation-sensitive resin composition comprising an acid labile group-containing resin, a radiation-sensitive acid generator, and a solvent, with specific repeating units and a solvent system that enhances alkali solubility, radiation transmittance, and dry etching resistance, allowing for improved pattern formation and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a phenolic base resin is used in chemically-amplified resist, then the resin provides good adhesion and chemical amplification properties, but deep ultraviolet rays are absorbed by the aromatic ring, causing trapezoidal resist pattern profile and poor resolution
Solution Approach 1:
The patent changes the chemical structure parameter by replacing aromatic rings with aliphatic rings in the resin backbone. This structural modification maintains the chemical amplification properties and adhesion while eliminating the harmful absorption of deep ultraviolet rays that caused trapezoidal patterns. The aliphatic ring structure allows radiation to pass through to lower layers, achieving rectangular pattern profiles and improved resolution.
Solution Approach 2:
The patent uses a composite resin system combining (meth)acrylate units with aliphatic rings and specific functional groups (carboxyl, hydroxyl, or carboxymethyl groups). This composite structure integrates the benefits of radiation transmittance from the aliphatic ring framework with the chemical amplification capability provided by the functional groups, resolving the contradiction between adhesion and pattern quality.
2Manufacturing precision
If a methacrylate resin is used to improve radiation transmittance, then the resin becomes highly transparent to deep ultraviolet rays, but dry etching resistance becomes insufficient
Solution Approach 1:
The patent creates a composite resin system that combines methacrylate units with aliphatic rings and specific functional groups (carboxyl, hydroxyl, or carboxymethyl groups). This composite structure provides both high radiation transmittance from the aliphatic ring framework and adequate dry etching resistance through the functional groups, resolving the contradiction between pattern quality and etching performance.
Solution Approach 2:
The patent introduces specific functional groups (carboxyl, hydroxyl, or carboxymethyl groups) at local positions within the polymer chain. These localized functional groups provide the necessary dry etching resistance without compromising the overall radiation transmittance property of the aliphatic ring structure, allowing different parts of the resin to fulfill different functions.
3Adaptability or versatility
If conventional chemically-amplified resist is used, then the process is suitable for standard lithography, but temperature-dependent line width fluctuations occur, hindering miniaturization
Solution Approach 1:
The patent modifies the resin structure by introducing aliphatic rings and specific functional groups that reduce temperature dependence. This parameter change in the chemical structure leads to reduced line width fluctuations during temperature variations, improving manufacturing precision while maintaining adaptability to standard lithography processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves high sensitivity, resolution, and pattern accuracy with reduced temperature dependency, enabling the formation of precise resist patterns suitable for advanced microfabrication and semiconductor manufacturing.
Implementation Method 1
a radiation-sensitive acid generator (B)
Implementation Method 2
a resist utilizing a chemical amplification effect between a component having an acid labile functional group and a component which generates an acid upon exposure to radiation
Implementation Method 3
the aliphatic ring has high transparency to deep ultraviolet rays
Data Source
AI summary
A radiation-sensitive resin composition includes (A) an acid labile group-containing resin which becomes alkali-soluble by an action of an acid, (B) a radiation-sensitive acid generator, and (C) a solvent. The resin (A) includes repeating units shown by formulas (1) and (2), wherein R1 and R2 represent a hydrogen atom or a substituted or unsubstituted alkyl group having 1 to 4 carbon atoms, R3 represents a substituted or unsubstituted alkyl group having 1 to 4 carbon atoms, X represents a hydrogen atom, a hydroxyl group, or an acyl group, m represents an integer from 1 to 18, and n represents an integer from 4 to 8.