Alkaline Cleaning Composition for Semiconductor Substrates
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing cleaning compositions for semiconductor manufacturing struggle to effectively remove residues of resists and inorganic films containing silicon without affecting subsequent processes and while minimizing environmental impact.
Innovation Solution
An alkaline cleaning composition comprising an alkaline compound, 5% to 40% propylene glycol monomethyl ether, 10% to 30% water, and a polar solvent such as acetals, glycol ethers, or pyrrolidones, which is free of benzenesulfonic acid, is used to clean and remove residues from semiconductor substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional cleaning compositions are used to remove residues of resists and inorganic films containing silicon, then cleaning effectiveness is improved, but environmental impact increases due to higher VOC content and harmful chemical emissions
Solution Approach 1:
The patent changes the chemical composition parameters by using a specific alkaline compound (tetramethylammonium hydroxide) with controlled concentration (0.1-10%), combined with specific solvents (propylene glycol monomethyl ether at 5-40%, polar solvent at 10-30%). This parameter optimization achieves effective residue removal while reducing harmful emissions and VOC content compared to conventional cleaning compositions.
Solution Approach 2:
The patent creates a composite cleaning composition by combining multiple components: alkaline compound, propylene glycol monomethyl ether, polar solvent (such as N-methyl-2-pyrrolidone), and water. This composite formulation synergistically achieves both effective cleaning of resist and silicon-containing film residues while minimizing environmental harm through reduced VOC and harmful chemical emissions.
2Reliability
If strong cleaning agents are used to remove all film layers, then cleaning effectiveness is improved, but subsequent processes are adversely affected
Solution Approach 1:
The patent optimizes the alkaline compound concentration to a moderate range (0.1-10%, preferably 0.5-5%) rather than using strong concentrated cleaners. This parameter control enables effective removal of organic and silicon-containing residues while maintaining substrate integrity and avoiding adverse effects on subsequent semiconductor manufacturing processes.
Solution Approach 2:
The cleaning composition is designed to selectively remove specific types of residues (organic resist materials and silicon-containing inorganic films) while being gentle enough not to damage the substrate or affect subsequent processes. The specific combination of alkaline compound and solvents provides targeted cleaning action appropriate for different residue types.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The alkaline cleaning composition achieves excellent removal of residues from semiconductor substrates, reduces volatile organic compound (VOC) content, and minimizes the impact on subsequent processes, thereby enhancing environmental protection and semiconductor manufacturing efficiency.
Implementation Method 1
The alkaline cleaning composition includes an alkaline compound, 5% to 40% by weight of propylene glycol monomethyl ether, 10% to 30% by weight of water, and a polar solvent. Wherein, the polar solvent includes acetals, glycol ethers, pyrrolidones, or a combination thereof
Data Source
AI summary
An alkaline cleaning composition is provided. The alkaline cleaning composition includes an alkaline compound, 5% to 40% by weight of propylene glycol monomethyl ether, 10% to 30% by weight of water, and a polar solvent. Wherein, the polar solvent includes acetals, glycol ethers, pyrrolidones, or a combination thereof, and the alkaline cleaning composition is free of benzenesulfonic acid.