Refined Copper via Alkaline Plating for Low Impurity
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Solution Overview
Problem
Conventional copper wire production methods using electrorefining processes result in sulfur and chlorine contamination, leading to decreased performance and unstable production, with high costs due to rare metal additives and complex casting control requirements.
Innovation Solution
A method involving an electroplating or electroless plating process in an alkaline bath without sulfur, chlorine, and oxygen, using copper cyanide to produce refined copper with controlled sulfur and chlorine concentrations, and employing stainless steel or composite cathodes to reduce impurity elution and enhance recyclability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional electrorefining process using sulfuric acid-cupric sulfate solution is used, then copper ions are effectively deposited on cathode, but sulfur and chlorine impurities are inevitably introduced into refined copper
Solution Approach 1:
The invention changes the chemical composition parameters of the plating bath by replacing conventional sulfuric acid-cupric sulfate solution with an alkaline plating bath containing copper cyanide and ammonium hydroxide. This parameter change eliminates sulfur and chlorine impurity introduction while maintaining effective copper deposition, as demonstrated by the reduced impurity content in refined copper produced using this method.
Solution Approach 2:
The invention introduces ammonium hydroxide as an intermediary substance that enables copper deposition without introducing harmful impurities. The ammonium hydroxide forms a complex with copper cyanide to create a stable plating solution that deposits copper cleanly, acting as a mediator between the copper source and the deposition process.
2Object-generated harmful factors
If rare metal additives are used to reduce sulfur concentration in copper melt, then sulfur removal is effective, but manufacturing cost increases significantly
Solution Approach 1:
The invention extracts the sulfur removal function from the copper refining process by preventing sulfur introduction at the source (plating bath stage) rather than requiring subsequent expensive extraction using rare metal additives. This eliminates the need for additional sulfur removal treatments and associated costs.
Solution Approach 2:
The invention replaces expensive rare metal additives with a cost-effective alkaline plating bath system using common chemicals (ammonium hydroxide and copper cyanide) that prevents impurity formation from the beginning, achieving sulfur removal without high-cost materials.
3Manufacturing precision
If complex casting control parameters are implemented to reduce impurity concentration, then copper quality improves, but production complexity and cost increase
Solution Approach 1:
The invention performs preliminary impurity prevention by using an alkaline plating bath that does not introduce sulfur and chlorine impurities in the first place. This preliminary action eliminates the need for complex subsequent casting control measures to remove impurities, simplifying the overall process.
Solution Approach 2:
The invention converts the potential harm of using non-conventional plating chemistry into a benefit by demonstrating that alkaline cyanide-based plating can produce ultra-low impurity copper, transforming what might be seen as a deviation from conventional methods into an advantage for impurity reduction.
4Productivity
If stainless steel cathode is reused multiple times in electrorefining, then production efficiency improves, but cathode performance degrades due to impurity elution
Solution Approach 1:
The alkaline plating bath creates a chemically inert environment for the stainless steel cathode that prevents impurity elution. The specific chemical composition (ammonium hydroxide and copper cyanide) forms a stable, non-corrosive atmosphere that protects the cathode material, allowing repeated use without performance degradation.
Solution Approach 2:
The invention enables effective recovery and reuse of stainless steel cathodes by preventing impurity accumulation during the electrorefining process. The alkaline bath chemistry prevents cathode degradation, allowing the cathodes to be recovered and reused multiple times maintaining consistent performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach stabilizes copper wire production with high conductivity and low softening temperature, reduces manufacturing costs, and improves recyclability of stainless steel cathodes, while minimizing sulfur and chlorine impurities, thus enhancing the quality and yield of copper wires.
Implementation Method 1
depositing the refined copper on a cathode by an electroplating process or an electroless plating process
Implementation Method 2
depositing the refined copper on a cathode by an electroplating process or an electroless plating process
Implementation Method 3
an alkaline plating bath which comprises a copper compound that produces copper ions having a valence of +1 in the solution
Data Source
AI summary
A method of producing a refined copper includes depositing the refined copper on a cathode by an electroplating process or an electroless plating process in an alkaline plating bath including a solution of a copper compound that includes none of sulfur, chlorine and oxygen elements and produces copper ions having a valence of +1 in the solution.