Alkanol Hydroxyamine Cleaning Liquid for Cobalt and Copper Corrosion
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Solution Overview
Problem
Semiconductor manufacturing processes face challenges in preventing corrosion of easily corrodible metals like cobalt, copper, and tungsten during cleaning, as conventional cleaning liquids can damage these materials, hindering the production of high-density and high-integration semiconductor devices.
Innovation Solution
A cleaning liquid and anticorrosion agent are developed using a mixture of alkanol hydroxyamine and alkanolamine, which effectively inhibit corrosion on cobalt, copper, tungsten, and their silicides by reducing their reactivity, while also being more water-soluble and having lower vapor pressure, thus allowing for effective substrate cleaning without damaging these metals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional cleaning liquids are used to remove residues, then cleaning effectiveness is improved, but corrosion of easily corrodible metals (cobalt, copper, tungsten, silicide) occurs
Solution Approach 1:
The invention changes the chemical composition parameters of the cleaning liquid by incorporating specific ratios of hydroxylamine derivative (0.01-5 mass%) and anticorrosion agent (0.1-5 mass%) to achieve both effective cleaning and corrosion protection for easily corrodible metals
Solution Approach 2:
The cleaning liquid is formulated as a composite composition containing multiple components including hydroxylamine derivative, anticorrosion agent, and other cleaning agents, where each component contributes specific functions to achieve both cleaning effectiveness and corrosion inhibition
2Productivity
If easily corrodible metals (cobalt, copper, tungsten, silicide) are used as metal wiring materials, then device integration and density are improved, but susceptibility to corrosion by cleaning liquids increases
Solution Approach 1:
The anticorrosion agent acts as an intermediary substance that forms a protective layer between the cleaning liquid and the easily corrodible metal wiring materials, preventing direct harmful interaction while allowing the cleaning process to proceed effectively
3Manufacturing precision
If cleaning liquids with strong cleaning power are used, then residue removal performance is improved, but damage to metal wiring layers increases
Solution Approach 1:
The invention optimizes the concentration parameters of cleaning agents and adds corrosion inhibition components to adjust the chemical aggressiveness of the cleaning liquid, achieving effective residue removal while preventing metal wiring layer damage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides excellent corrosion inhibition for cobalt, copper, tungsten, and their silicides, ensuring effective removal of residues without etching these metals, thereby supporting the manufacturing of high-density semiconductor devices with improved integration and stability.
Implementation Method 1
a cleaning liquid and anticorrosion agent are developed using a mixture of alkanol hydroxyamine and alkanolamine, which effectively inhibit corrosion on cobalt, copper, tungsten, and their silicides by reducing their reactivity
Implementation Method 2
synthesizing the alkanol hydroxyamine by oxidizing alkanolamine
Data Source
AI summary
A cleaning liquid and an anticorrosion agent having an excellent corrosion inhibition function, and a method for manufacturing the same. The cleaning liquid contains alkanol hydroxyamine represented by general formula (1), alkanolamine represented by general formula (2), a solvent, and a basic compound other than the alkanol hydroxyamine and the alkanolamine or an acidic compound. In the general formula (1), Ra1 and Ra2 each independently represents a C1-C10 alkyl group having one to three hydroxy groups, or a hydrogen atom, Ra1 and Ra2 are not simultaneously a hydrogen atom, and Rb1 and Rb2 are not simultaneously a hydrogen atom.