Alkanol Hydroxyamine Cleaning Liquid for Corrosion Inhibition
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Solution Overview
Problem
Semiconductor manufacturing processes face challenges in preventing corrosion of easily corrodible metals like cobalt, copper, and tungsten during cleaning, as conventional cleaning liquids tend to corrode these materials, hindering the manufacturing process.
Innovation Solution
A cleaning liquid composition containing alkanol hydroxyamine and a basic compound, such as quaternary ammonium hydroxide, is developed to inhibit corrosion of cobalt, copper, tungsten, and their silicides, ensuring effective removal of residues while protecting these metals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional cleaning liquids are used to remove residues from semiconductor substrates, then cleaning effectiveness is improved, but corrosion of easily corrodible metals (cobalt, copper, tungsten, silicide) occurs
Solution Approach 1:
The patent changes the chemical parameters of the cleaning liquid by specifying precise compositional ratios: alkanol hydroxyamine (0.01-5 mass%), basic compound (0.1-10 mass%), and water (85-99.9 mass%). This parameter optimization enables effective residue removal while minimizing corrosion of easily corrodible metals like cobalt, copper, and tungsten used in damascene wiring structures
Solution Approach 2:
The invention creates a composite cleaning liquid formulation combining multiple chemical components with specific functions: alkanol hydroxyamine for primary cleaning action, basic compound for pH control and enhanced effectiveness, and water as solvent. This composite approach achieves both cleaning effectiveness and corrosion inhibition that single-component solutions cannot provide
2Manufacturing precision
If cleaning liquids with strong cleaning power are used, then residue removal performance is improved, but damage to metal wiring materials increases
Solution Approach 1:
The patent optimizes the concentration parameters of cleaning agents to achieve the right balance: alkanol hydroxyamine at 0.01-5 mass% provides sufficient cleaning power for residue removal, while the basic compound at 0.1-10 mass% maintains appropriate pH levels. This parameter control ensures high manufacturing precision in residue removal without compromising the reliability of metal wiring layers
Solution Approach 2:
The basic compound acts as an intermediary substance that mediates between the cleaning action and the metal wiring layers. It buffers the pH and moderates the chemical environment, allowing effective residue removal while protecting sensitive metals like cobalt, copper, and tungsten from direct corrosive attack
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cleaning liquid effectively inhibits corrosion of cobalt, copper, and tungsten, allowing for efficient cleaning of semiconductor substrates without damaging the metal wiring layers, thereby enhancing the semiconductor manufacturing process.
Implementation Method 1
use of specific alkanol hydroxyamine and a basic compound for a cleaning liquid can solve the above-mentioned problem... having an excellent corrosion inhibition function with respect to at least cobalt, copper, tungsten, silicide such as SiGe or other easily corrodible metal
Implementation Method 2
a synthesis step of synthesizing the alkanol hydroxyamine by oxidizing alkanolamine
Data Source
AI summary
A cleaning liquid having an excellent corrosion inhibition function, and a method for manufacturing the same. The cleaning liquid contains alkanol hydroxyamine represented by general formula (1), and a basic compound other than the alkanol hydroxyamine. In the formula, Ra1 and Ra2 each independently represents a C1-C10 alkyl group having one to three hydroxy groups, or a hydrogen atom, and Ra1 and Ra2 are not simultaneously a hydrogen atom.