Alkanolamine Cleaning Composition for Plasma Etch Residue Removal
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Solution Overview
Problem
Existing cleaning formulations for removing plasma etch residues from microelectronic substrates often harm metallic layers, particularly aluminum and titanium, due to the presence of hydroxylamine and inadequate corrosion protection for AlCu alloys.
Innovation Solution
A cleaning composition comprising alkanolamine, hydroxylamine or its derivatives, polyfunctional organic acid with at least two carboxylic acid groups, and water, optionally including corrosion inhibitors, is used to effectively remove plasma etch residues without damaging metal layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional cleaning formulations containing hydroxylamine and alkanolamine are used to remove plasma etch residues, then cleaning effectiveness is improved, but corrosion of metallic layers particularly aluminum and copper is increased
Solution Approach 1:
The patent introduces a corrosion inhibitor as an intermediary substance that mediates between the cleaning action of hydroxylamine/alkanolamine and the metallic layers. This corrosion inhibitor specifically targets and protects aluminum and copper from corrosion while allowing the primary cleaning components to effectively remove plasma etch residues, thus resolving the contradiction between cleaning effectiveness and metal protection
Solution Approach 2:
The patent modifies the chemical parameters of the cleaning formulation by adjusting the concentrations and types of corrosion inhibitors present. By changing these compositional parameters, the formulation achieves optimal balance between maintaining strong cleaning capability against plasma etch residues and providing sufficient protection against corrosion of aluminum and copper metallic layers
2Object-affected harmful factors
If corrosion inhibitors such as catechol and gallic acid are added to protect metal layers, then metal corrosion is reduced, but effectiveness against AlCu alloys is insufficient
Solution Approach 1:
The patent employs a composite corrosion protection approach by combining multiple corrosion inhibitors (including catechol, gallic acid, and additional inhibitors specifically effective against AlCu alloys) within the cleaning formulation. This composite approach leverages the complementary properties of different inhibitors to achieve comprehensive protection against aluminum and copper, particularly AlCu alloys, while maintaining cleaning effectiveness
Solution Approach 2:
The patent applies local quality protection by selecting and positioning corrosion inhibitors that specifically target different metal components. The formulation includes inhibitors with specific affinity for aluminum and copper, ensuring that each metal layer receives appropriate localized protection tailored to its specific corrosion susceptibility, thereby improving overall reliability against AlCu alloy corrosion
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves efficient removal of plasma etch residues while minimizing etch rates of metal and dielectric materials, thereby protecting sensitive layers like AlCu alloys and maintaining the integrity of microelectronic substrates.
Implementation Method 1
polyfunctional organic acid with at least two carboxylic acid groups
Implementation Method 2
formulated solution can effectively clean plasma etching residues
Implementation Method 3
complex mixture that may include re-sputtered oxide material, organic materials from photoresist
Data Source
AI summary
A method and cleaning composition for microelectronic devices or semiconductor substrates including at least one alkanolamine; at least one hydroxylamine or derivatives of hydroxylamine or mixtures thereof; at least one polyfunctional organic acid with at least two carboxylic acid groups and water. The cleaning compositions can further include at least one corrosion inhibitor.