Alkoxysilyl Compound Low CTE Thermal Stability
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Solution Overview
Problem
Current thermosetting epoxy compounds exhibit high coefficients of thermal expansion (CTE), leading to mismatch issues with inorganic materials in electronic components, limiting their integration, miniaturization, and reliability due to high dimensional changes and processability challenges.
Innovation Solution
A thermosetting alkoxysilyl compound with two or more alkoxysilyl groups, specifically formulated to have a low CTE and no glass transition temperature, is developed, which, when combined with inorganic particles or fibers, forms a composite exhibiting improved heat resistance and flame retardant properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a large amount of inorganic particles is used to decrease CTE, then thermal expansion properties are improved, but processability and physical properties are deteriorated due to decreased fluidity and increased viscosity
Solution Approach 1:
The invention changes the chemical composition parameters of the resin system by introducing a specific alkoxysilyl compound with two or more alkoxysilyl groups and a hydroxyl group. This chemical parameter change enables the resin to form a three-dimensional crosslinked structure upon curing, which inherently provides low CTE without requiring excessive inorganic fillers, thus maintaining processability.
Solution Approach 2:
The invention creates a composite cured product combining the alkoxysilyl compound resin with inorganic particles. The resin forms a crosslinked network structure that works synergistically with the inorganic particles to achieve low CTE, allowing for optimized filler content that balances thermal expansion control with manufacturing processability.
2Stability of the object's composition
If inorganic particles are added to improve thermal expansion properties, then CTE is decreased, but viscosity increases exponentially
Solution Approach 1:
The invention modifies the resin's chemical structure by incorporating alkoxysilyl groups that undergo condensation reactions to form crosslinked networks. This structural parameter change creates a resin system with inherently lower thermal expansion that requires less inorganic filler to achieve target CTE values, thereby reducing the viscosity increase associated with filler addition.
3Stability of the object's composition
If the CTE of thermosetting material is reduced to match inorganic materials, then dimensional stability is improved, but the material complexity increases
Solution Approach 1:
The invention achieves dimensional stability by changing the chemical composition of the base resin to include alkoxysilyl compounds with specific molecular structures. This approach reduces CTE to match inorganic materials without requiring complex multi-component systems or excessive filler loads, thereby minimizing material complexity while achieving the desired dimensional stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The alkoxysilyl compound significantly reduces CTE and eliminates glass transition temperature issues, enhancing the thermal stability and processability of electronic components, while also providing excellent flame retardant properties in the cured product.
Implementation Method 1
a thermosetting alkoxysilyl compound having two or more alkoxysilyl groups... exhibiting excellent heat resistance properties... low coefficient of thermal expansion (CTE) and Tg-less
Implementation Method 2
the coefficient of thermal expansion of a thermosetting organic material is about 50 to 80 ppm/° C. and it is significant higher several to tens times than the CTE of a inorganic particles... the alkoxysilyl compound significantly reduces CTE
Data Source
AI summary
The present invention relates to: a thermosetting alkoxysilyl compound (hereinafter, referred to as “alkoxysilyl compound”) having two or more alkoxysilyl groups showing excellent heat-resistance characteristics in a composite; a composition and a cured product comprising the same; a use thereof; and a method for preparing an alkoxysilyl compound. The composition of an alkoxysilyl compound, comprising a novel alkoxysilyl compound according to the present invention shows, in a composite, improved heat-resistance characteristics, i.e., an effect of decreasing the CTE of the composition of an alkoxysilyl compound and not showing a glass transition temperature (hereinafter, referred to as “Tg-less”). Further, the cured product comprising an alkoxysilyl compound according to the present invention shows excellent flame retardant properties due to the alkoxysilyl groups.