Alkoxysilyl-Ester Epoxy Curing Agent for Low Moisture Absorption
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Solution Overview
Problem
Epoxy materials used in semiconductor and electronic applications face challenges with high moisture absorption leading to stress and reliability issues, and high thermal expansion coefficients causing dimensional instability and product defects due to mismatch with ceramic and metal materials.
Innovation Solution
A compound with an alkoxysilyl group and an active ester group is developed, which when incorporated into epoxy compositions, exhibits improved low moisture absorption and low dielectric properties without compromising thermal expansion properties, achieved through specific esterification and alkoxysilylation processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a curing agent with an active ester group is used to improve low moisture absorption, then moisture absorption is reduced, but thermal expansion properties are deteriorated
Solution Approach 1:
The invention uses a composite curing agent containing both active ester groups and specific hydrophobic groups (such as fluorinated groups, aromatic groups, or long-chain alkyl groups) in a defined ratio. This composite approach allows the active ester group to provide low moisture absorption while the hydrophobic groups compensate for thermal expansion properties, resolving the contradiction between these two requirements.
Solution Approach 2:
The invention changes the chemical structure parameters of the curing agent by introducing specific hydrophobic groups with defined molecular weights and structures. By adjusting the ratio of active ester groups to hydrophobic groups (specifically when the hydrophobic group content is 10-90 wt%), the material achieves both low moisture absorption and acceptable thermal expansion properties.
2Quantity of substance
If crosslinking density is decreased to improve low moisture absorption, then moisture absorption is reduced, but heat resistance properties degrade
Solution Approach 1:
The invention changes the chemical composition parameters of the curing agent by incorporating hydrophobic groups with specific molecular characteristics. This allows the material to achieve low moisture absorption through reduced polarity while maintaining heat resistance through the structural integrity provided by the hydrophobic groups and controlled crosslinking density.
Solution Approach 2:
The composite curing agent combines functional groups with different properties: active ester groups for low moisture absorption and hydrophobic groups for maintaining thermal stability. This composite structure enables simultaneous achievement of low moisture absorption and heat resistance without requiring extreme changes in crosslinking density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The compound effectively reduces moisture absorption and dielectric properties while maintaining thermal expansion performance, enhancing the reliability and stability of electronic components by preventing stress and dimensional instability issues.
Implementation Method 1
a compound having an alkoxysilyl group and an active ester group
Implementation Method 2
when its epoxy composition is cured
Implementation Method 3
esterification and alkoxysilylation processes
Data Source
AI summary
The present invention relates to a novel compound having an alkoxysilyl group and an active ester group, a method for preparing the same, a composition comprising the same, and a use, wherein the novel compound exhibits improved low moisture absorption and/or low dielectric properties when cured as an epoxy composition, but is not accompanied by loss of thermal expansion characteristics. Disclosed are a novel compound of formulae AF to LF having an alkoxysilyl group and an active ester group, and a method for preparing the same, a composition comprising the same, and a use of same.