Alkoxysilylated Epoxy Reduces CTE Without Filler Viscosity Penalty
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Epoxy composites exhibit high coefficients of thermal expansion (CTE) that mismatch with metal or ceramic materials, leading to defects and processability issues in electronic components like semiconductor substrates and PCBs, limiting their integration, miniaturization, and performance.
Innovation Solution
An alkoxysilylated epoxy compound with specific chemical structures and preparation methods that form strong bonds with fillers, reducing CTE and increasing glass transition temperature, eliminating the need for separate coupling agents and enhancing thermal expansion properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a large amount of inorganic silica particles is used to decrease CTE, then the CTE decreases, but the processability and physical properties deteriorate due to decreased fluidity and increased viscosity
Solution Approach 1:
The patent changes the chemical composition parameters of the epoxy compound by introducing specific structural features (aromatic rings, rigid groups) to achieve low CTE without relying on large amounts of inorganic fillers. This modifies the base resin's thermal expansion properties at the molecular level, avoiding the viscosity and processability issues associated with high filler content.
Solution Approach 2:
The patent creates a composite epoxy system by combining the specially designed epoxy compound with inorganic fillers and coupling agents. The coupling agent forms chemical bonds between the organic epoxy matrix and inorganic filler surfaces, creating an interfacial composite structure that enhances filler dispersion and reduces aggregate formation, thereby maintaining processability while achieving low CTE.
2Stability of the object's composition
If inorganic particles are used as filler to improve thermal expansion properties, then CTE decreases, but viscosity increases exponentially
Solution Approach 1:
The patent introduces a coupling agent as an intermediary substance between the inorganic filler particles and the epoxy matrix. This coupling agent has dual functionality: it bonds to the inorganic filler surface through chemical reactions and also interacts with the epoxy resin, creating a bridging interface that prevents filler aggregation and maintains low viscosity even at high filler loadings.
Solution Approach 2:
The patent modifies the surface chemistry parameters of the inorganic filler by treating it with coupling agents, changing the interfacial properties between filler and matrix. This surface modification reduces friction and aggregation between particles, allowing for high filler content without exponential viscosity increase.
3Stability of the object's composition
If inorganic particles are used as filler, then CTE decreases, but the frequency of insufficient filling increases
Solution Approach 1:
The coupling agent acts as a lubricating intermediary at the filler-matrix interface, reducing friction and improving the flow characteristics of the composite material. This enables complete filling of narrow spaces and complex geometries even with high filler content, eliminating insufficient filling defects.
Solution Approach 2:
The patent changes the rheological parameters of the epoxy composite by optimizing the balance between filler content, coupling agent concentration, and resin viscosity. This parameter optimization ensures adequate fluidity for complete mold filling while maintaining the desired low CTE properties.
4Stability of the object's composition
If epoxy compound with inorganic filler is used to obtain low CTE, then thermal expansion properties improve, but adhesiveness and brittleness worsen
Solution Approach 1:
The coupling agent serves as a chemical intermediary that forms strong bonds with both the inorganic filler surface and the organic epoxy matrix. This dual-bonding capability creates a robust interfacial adhesion layer that prevents filler-matrix debonding, maintaining high adhesiveness even at high filler loadings required for low CTE.
Solution Approach 2:
The patent creates a tri-phase composite system consisting of inorganic filler, coupling agent, and epoxy matrix. The coupling agent phase acts as a transition zone that transfers stresses effectively between the rigid filler and the polymer matrix, preventing crack propagation and maintaining toughness and adhesiveness in the composite material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The alkoxysilylated epoxy compound achieves reduced CTE, improved dimensional stability, and good flame retardancy, ensuring reliable and processable electronic components with enhanced thermal performance.
Implementation Method 1
an alkoxysilylated epoxy compound... form strong bonds with fillers
Implementation Method 2
a cured product thereof exhibiting good flame retardancy
Data Source
AI summary
Provided are an alkoxysilylated epoxy compound, a composite of which exhibits good heat resistance properties, low CTE and increased glass transition temperature, and a cured product thereof exhibits good flame retardancy without requiring separate coupling agent, a method for preparing the same and a composition and a cured product including the same. An alkoxysilylated epoxy compound including an epoxy group and at least one alkoxysilyl group of an S1 substituent selected from Formulae S11 to S15 or an S2 substituent selected from Formulae S21 to S25; a method for preparing the same by epoxy ring-opening reaction of starting material and alkoxysilylation, an epoxy composition including the epoxy compound, and a cured product and a use of the composition, are provided. Since chemical bonds may be formed between alkoxysilyl group and filler and between alkoxysilyl groups, chemical bonding efficiency of the composite may be improved.