Alkoxysilylated Epoxy Resin for Low CTE and High Tg
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Solution Overview
Problem
Epoxy resin composites exhibit high coefficients of thermal expansion (CTE) that mismatch with inorganic and metal materials, leading to defects and processability issues in electronic components, limiting the development of next-generation semiconductor substrates and printed circuit boards due to high thermal expansion properties.
Innovation Solution
Development of an alkoxysilylated epoxy compound with a low CTE and high glass transition temperature (Tg), which forms strong chemical bonds with fillers, eliminating the need for silane coupling agents and enhancing thermal stability and flame retardancy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a large amount of inorganic silica particles are added to decrease CTE, then the CTE value is significantly reduced, but the viscosity increases exponentially and processability deteriorates
Solution Approach 1:
The invention changes the chemical composition parameters of the epoxy resin by incorporating specific aromatic rings (naphthalene, fluorene, anthracene) and heterocyclic structures (isocyanurate) to achieve low CTE without relying on high filler content. This molecular-level parameter change allows the base resin itself to have reduced thermal expansion, avoiding the viscosity and processability issues associated with adding large amounts of inorganic fillers.
Solution Approach 2:
The invention creates a composite molecular structure within the epoxy resin by combining multiple aromatic rings, heterocyclic groups, and epoxy functionalities in a single polymeric chain. This internal composite structure provides both the low CTE property and maintains processability, eliminating the need to add external inorganic fillers that would compromise fluidity and filling performance.
2Stability of the object's composition
If inorganic particles are added to improve thermal expansion properties, then CTE is decreased, but fluidity decreases and voids are generated during filling
Solution Approach 1:
The invention modifies the molecular parameters of the epoxy resin by incorporating rigid aromatic structures and heterocyclic groups that inherently reduce thermal expansion. This chemical parameter change achieves low CTE at the molecular level, eliminating the need to add inorganic particles that would compromise fluidity and filling performance.
3Stability of the object's composition
If fiber composite is used to decrease CTE, then CTE is reduced, but the CTE is still higher than silicon chip and processability is limited
Solution Approach 1:
The invention achieves superior CTE reduction by changing the chemical composition of the base epoxy resin to include multiple aromatic rings and heterocyclic structures. This molecular-level composition change produces a resin with inherently low thermal expansion, outperforming fiber composites while maintaining excellent processability without the complexity of fiber reinforcement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The alkoxysilylated epoxy compound achieves a low CTE, high Tg, and improved adhesive properties, reducing defects and enhancing processability in electronic components, while providing good flame retardancy without the need for additional coupling agents.
Implementation Method 1
the alkoxysilyl group may form interfacial bonding with inorganic particles and/or a fiber
Implementation Method 2
a cured product formed by curing an epoxy composition
Data Source
AI summary
Provided are an alkoxysilylated epoxy compound, a composite of which exhibits good heat resistance properties, particularly low CTE and increased glass transition temperature, and a cured product thereof exhibits good flame retardancy and composition of which does not require additional silane coupling agent, a method for preparing the same and a composition and a cured product including the same. An alkoxysilylated epoxy compound including at least one alkoxysilyl group and at least two epoxy groups, a method for preparing the same by epoxide ring-opening reaction of starting material and alkoxysilylation, an epoxy composition including the epoxy compound, and a cured product and a use of the composition are provided. Since chemical bonds may be formed between alkoxysilyl group and filler and between alkoxysilyl groups, chemical bonding efficiency of the composite may be improved. Thus, the composite exhibits good heat resistance properties and the cured product exhibits good flame retardancy.