All-directions Embedded Module With Side Wall Circuits
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Solution Overview
Problem
Existing electronic device packaging structures limit package flexibility and signal transmission paths due to the inability of embedded passive components to achieve all-directional conduction, requiring complex manufacturing processes.
Innovation Solution
The development of an all-directions embedded module with a substrate layer and outer circuit layers, featuring side wall circuits and conductive holes for multi-directional connectivity, allowing for flexible arrangement and increased signal transmission paths without the need for encapsulation in an insulating substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If passive components are placed horizontally in cavities and more layers are added, then the embedded passive components can be embedded in circuit boards, but the embedded passive components cannot achieve all-directions conduction, which limits package flexibility and signal transmission paths
Solution Approach 1:
The patent transitions from traditional horizontal planar embedding to three-dimensional embedding where passive components are positioned vertically and diagonally within the circuit board. Conductive vias connect component terminals to circuit traces on multiple layers, enabling signal transmission in multiple spatial dimensions (X, Y, Z axes) rather than仅限于平面方向，从而实现all-directions conduction并提升package flexibility
Solution Approach 2:
The patent embeds passive components within cavities formed in the circuit board structure, nesting components inside the board volume rather than placing them on the surface. Multiple circuit layers are nested around the embedded components, with conductive vias penetrating through the board to connect component terminals to external circuits, creating a compact three-dimensional integrated structure that reduces packaging complexity
2Quantity of substance
If passive components are placed horizontally in cavities, then components can be embedded, but signal transmission paths are limited and packaging processes become more complex
Solution Approach 1:
The patent creates multiple signal transmission paths by routing signals through conductive vias that connect embedded component terminals to circuit traces on different layers. This three-dimensional via structure enables signals to travel vertically and diagonally through the board, multiplying the number of available transmission paths compared to traditional planar routing, thereby increasing the quantity of signal transmission paths without proportionally increasing packaging complexity
Data Source
AI summary
An all-directions embedded module includes a substrate layer, many first embedded pads, many second embedded pads, and many side wall circuits. The substrate layer comprises a first surface, a second surface opposite to the first surface, and a plurality of side surfaces connected to the first surface and the second surface. The first embedded pads is formed on the first surface. The second embedded pads is formed on the second surface. The side wall circuits embedded in the substrate layer and exposed from the side surfaces. The all-directions embedded module further includes a plurality of first connecting circuits formed on the first surface and a plurality of second connecting circuits formed on the second surface. The first embedded pads is connected to the side wall circuits by the first connecting circuits. The second embedded pads is connected to the side wall circuits by the second connecting circuits.