Aluminum Alloy Wire Bonding Temperature Control
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Solution Overview
Problem
Existing semiconductor device manufacturing methods face challenges in wire bonding aluminum alloy wires with diameters between 500 μm and 600 μm, as high heating temperatures lead to unbonded regions and insufficient bonding areas, while low temperatures result in insufficient bonding strength.
Innovation Solution
A wire bonding apparatus and method that heat the aluminum alloy wire to a temperature between 50°C and 100°C, using a combination of a wire heater, flat plate heater, temperature sensor, and ultrasonic vibration to ensure effective bonding by controlling the temperature and applying pressure, thereby increasing the bonded area and reducing energy consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If high heating temperature is used during wire bonding, then bonding strength is improved, but unbonded regions are generated and bonding area is reduced
Solution Approach 1:
The patent applies parameter changes by precisely controlling the heating temperature within the range of 50°C to 100°C during wire bonding. This temperature parameter optimization prevents the generation of unbonded regions while ensuring sufficient bonding strength, resolving the contradiction between bonding strength and bonding area
2Manufacturing precision
If low heating temperature is used during wire bonding, then unbonded regions are minimized, but bonding strength is insufficient
Solution Approach 1:
The patent implements parameter changes by establishing the optimal heating temperature range of 50°C to 100°C. This parameter control ensures that the bonding area is maximized without creating unbonded regions, while simultaneously achieving sufficient bonding strength through the combined effect of controlled heating and ultrasonic vibration
3Ease of manufacture
If high temperature heating is applied, then bonding process is facilitated, but energy consumption increases
Solution Approach 1:
The patent applies parameter changes by reducing the heating temperature to the range of 50°C to 100°C, which is significantly lower than conventional high-temperature processes. This temperature optimization facilitates the bonding process through enhanced material ductility and reduced oxide layer strength, while simultaneously reducing energy consumption associated with heating
Solution Approach 2:
The patent replaces thermal energy with mechanical energy by introducing ultrasonic vibration during the bonding process. The ultrasonic vibration provides the necessary energy for bond formation through mechanical oscillation, allowing the process to proceed at lower temperatures and thereby reducing overall energy consumption
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves sufficient bonding strength and area for wires with diameters between 500 μm and 600 μm, minimizing unbonded regions and reducing energy consumption by maintaining the wire temperature within the optimal range.
Implementation Method 1
a heating device which heats the wire to a temperature not lower than 50° C. and not higher than 100° C.
Implementation Method 2
an ultrasonic wave generating device which applies ultrasonic vibration to the wire pressed by the pressure device
Implementation Method 3
a pressure device which presses the wire against the electrode
Data Source
AI summary
Provided is a wire bonding apparatus for electrically connecting an electrode and an aluminum alloy wire to each other by wire bonding. The apparatus includes a wire feeding device which feeds the wire. The wire has a diameter not less than 500 μm and not greater than 600 μm. The apparatus includes a heating device heats the wire to a temperature that is not lower than 50° C. and not higher than 100° C. The apparatus further includes a pressure device which presses the wire against the electrode. The apparatus further includes an ultrasonic wave generating device which generates an ultrasonic vibration that is applied to the wire that is pressed by the pressure device.