Allyl-Modified Bismaleimide Resin for Low Dielectric Loss
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional dielectric materials, such as epoxy resin, fail to meet the demands of high-frequency and high-speed signal transmission in electronic components due to high dielectric dissipation factors, and alternative materials like fluoro-based resins are difficult to process and costly.
Innovation Solution
An allyl-containing resin is developed, which modifies bismaleimide resin to reduce its dielectric dissipation factor and constant, enhancing its operable range while maintaining high heat resistance, suitable for high-frequency applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional dielectric materials like epoxy resin are used, then processing is easy and cost is low, but dielectric dissipation factor is high making them unsuitable for high-frequency applications
Solution Approach 1:
The patent employs composite materials by combining bismaleimide resin with allyl-containing compounds to create a modified resin system. This composite approach leverages the low dielectric dissipation of bismaleimide while the allyl-containing modifier improves processability and reduces viscosity, thereby achieving both low Df and ease of manufacture simultaneously
Solution Approach 2:
The patent applies parameter changes by modifying the chemical structure of bismaleimide resin through the addition of allyl-containing compounds. This chemical modification alters key parameters such as viscosity, glass transition temperature, and dielectric properties, enabling the material to meet high-frequency requirements while maintaining manufacturability
2Reliability
If fluoro-based resin like polytetrafluoroethene is used, then dielectric dissipation factor is very low (0.0004), but processing is difficult and cost is high
Solution Approach 1:
The patent uses a cost-effective alternative to expensive fluoro-based resins by employing bismaleimide resin modified with allyl-containing compounds. This substitution achieves comparable low dielectric dissipation performance at a lower cost and with improved processability, effectively replacing the expensive fluoro-based materials
3Reliability
If polyphenylene ether resin is used, then dielectric dissipation factor reaches 0.0007, but glass transition temperature is low and processing is difficult
Solution Approach 1:
The patent creates a composite resin system by combining bismaleimide with allyl-containing compounds. This composite structure achieves low dielectric dissipation similar to polyphenylene ether while maintaining the high glass transition temperature characteristic of bismaleimide, thereby overcoming the low Tg limitation of polyphenylene ether
4Temperature
If bismaleimide resin is used, then heat resistance and reactivity are excellent, but dielectric dissipation factor is higher than ideal for high-frequency applications
Solution Approach 1:
The patent applies parameter changes by chemically modifying bismaleimide resin through the addition of allyl-containing compounds. This modification optimizes the dielectric dissipation factor while preserving the high heat resistance and reactivity of the original bismaleimide structure, achieving a balanced performance profile
Data Source
AI summary
An allyl-containing resin is provided. The allyl-containing resin comprises a repeating unit comprising a structural unit represented by the following formula (I):wherein, R1 to R3 in formula (I) are as defined in the specification; the Fourier transform infrared spectrum of the allyl-containing resin has a signal intensity “a” from 1650 cm−1 to 1630 cm−1 and a signal intensity “b” from 1620 cm−1 to 1560 cm−1, and 0<a/b≤1.20; and the quantitative 1H-NMR spectrum of the allyl-containing resin has a signal intensity “c” from 3.2 ppm to 6.2 ppm and a signal intensity “d” from 6.6 ppm to 7.4 ppm, and 0<c/d≤1.20.