Aluminum Nitride Ceramic Substrate Via Fill for Adhesion Control
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Solution Overview
Problem
Existing ceramic substrates face challenges in achieving high adhesion between the ceramic plate and conductive members within through holes or recessed portions, and there is a need to suppress metal migration in these components.
Innovation Solution
A method involving laser irradiation to form through holes or recessed portions in a ceramic plate containing aluminum nitride, followed by precipitating aluminum, removing it from the inner surfaces, and filling these features with a conductive paste to create a nitride coating film, enhancing adhesion and preventing metal migration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a through hole is formed in a ceramic plate and filled with conductive material, then electrical connectivity between surfaces is achieved, but adhesion between the ceramic plate and conductive member is insufficient and metal migration occurs
Solution Approach 1:
A nitride coating film is introduced as an intermediary layer between the ceramic plate and the conductive member. This coating film acts as a mediator that improves adhesion between the ceramic substrate and conductive material while simultaneously preventing metal migration, resolving the contradiction by providing a functional interface that delivers both bonding strength and migration barrier properties
Solution Approach 2:
The structure employs a composite material system consisting of the ceramic plate, nitride coating film, and conductive member. This multi-layer composite structure combines the advantages of each material: the ceramic provides structural integrity, the nitride coating provides adhesion and migration prevention, and the conductive material provides electrical connectivity, thereby achieving both strong adhesion and migration suppression
2Ease of manufacture
If conventional methods are used to form through holes in ceramic plates, then manufacturing is simpler, but adhesion between ceramic plate and conductive member deteriorates
Solution Approach 1:
The nitride coating film is formed on the inner surface of the through hole before the conductive member is filled in. This preliminary action of coating the substrate surface ensures that when the conductive material is subsequently introduced, it achieves strong adhesion from the outset, thereby improving reliability without significantly complicating the manufacturing sequence
Solution Approach 2:
The nitride coating film serves as an intermediary layer that is applied to the ceramic plate surface prior to conductive material deposition. This intermediate step creates a surface that is more receptive to the conductive material, enhancing adhesion while maintaining a straightforward manufacturing process flow
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a highly reliable ceramic substrate with improved adhesion and reduced metal migration, suitable for manufacturing light-emitting devices with enhanced electrical connectivity.
Implementation Method 1
forming a through hole or a recessed portion in a ceramic plate containing aluminum nitride and having a first surface and a second surface opposite to the first surface by irradiating the ceramic plate with a laser so that aluminum is precipitated
Data Source
AI summary
A method for manufacturing a ceramic substrate including forming a through hole or a recessed portion in a ceramic plate containing aluminum nitride and having a first surface and a second surface opposite to the first surface by irradiating the ceramic plate with a laser so that aluminum is precipitated, removing the aluminum precipitated on an inner surface of the through hole or the recessed portion, and disposing a conductive paste inside the through hole or the recessed portion.