AlOx Layer Thin Film Encapsulation Adhesion
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Solution Overview
Problem
The existing thin film encapsulation structures in flat panel display devices face issues with the smooth adhesion and release of protective films, leading to reduced encapsulation functionality and increased manufacturing errors due to strong adhesive forces with inorganic layers like silicon nitride.
Innovation Solution
Incorporating an aluminum oxide (AlOx) layer as the outermost thin film layer in the thin film encapsulation structure, alternately stacked with organic and inorganic layers, including silicon nitride, to facilitate smooth adhesion and release of protective films while maintaining moisture and oxygen barrier functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the protective film is adhered onto the inorganic layer (silicon nitride) of the thin film encapsulation structure, then the protective film can be adhered, but the adhesive force becomes too strong causing difficulty in smooth release and potential damage to the encapsulation structure
Solution Approach 1:
An aluminum oxide (AlOx) layer is introduced as an intermediary between the protective film and the inorganic layer. This AlOx layer serves as a mediator that reduces the adhesive force while maintaining sufficient bonding during the protective film adhesion process, enabling smooth release without damaging the encapsulation structure.
Solution Approach 2:
The surface properties of the encapsulation structure are modified by adding the AlOx layer, which changes the adhesive parameters. This layer alters the surface energy and chemical composition, reducing the adhesive force to an optimal level that allows for easy release while preventing damage to the underlying structure.
2Reliability
If the protective film is adhered onto the thin film encapsulation structure, then the protective film can be adhered, but the encapsulation function may be reduced if the protective film is not released smoothly
Solution Approach 1:
The aluminum oxide layer acts as a protective intermediary that prevents direct strong adhesion between the protective film and the inorganic layer. This ensures the encapsulation structure maintains its integrity and functionality while allowing the protective film to be released smoothly, reducing manufacturing errors.
3Object-affected harmful factors
If the thin film encapsulation structure uses inorganic layers to prevent penetration of oxygen or moisture, then barrier protection is achieved, but the adhesive force with protective films becomes too strong
Solution Approach 1:
The encapsulation structure uses a composite layer configuration combining inorganic layers (silicon nitride) for barrier protection with an aluminum oxide intermediate layer. This composite structure maintains the moisture and oxygen blocking capability of the inorganic layer while the AlOx layer provides controlled adhesion properties for the protective film.
Data Source
AI summary
A flat panel display device and a manufacturing method thereof. In the flat panel display device, a thin film encapsulation structure covering a display unit on a substrate includes an alternating layers stack in which organic layers and inorganic layers are alternately stacked; and an AlOx layer on the alternating layers stack as an outermost thin film layer of the thin film encapsulation structure. According to the above structure, because the protective film is adhered onto the AlOx layer of the thin film encapsulation structure, which has a relatively weak adhesive force, the adhering and releasing processes may be performed smoothly, and thus, the thin film encapsulation structure may be prevented from being damaged in the adhering and releasing processes.