Multi-functional Ambient Light Sensor Package for Compact Touch Displays
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Solution Overview
Problem
Conventional input devices and computing systems face space and cost constraints due to separately packaged ambient light sensors (ALS) and touch controllers, which limits their integration in compact devices like wearables, laptops, and smartphones.
Innovation Solution
A multi-functional ambient light sensor package is integrated with touch sensing electrodes and a controller on a single chip, using a wafer-level chip-scale package (WLCSP) or optical quad flat no-lead (OQFN) package, enabling combined capacitance, ambient light, and inductive sensing capabilities within a single chip for space and cost savings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ambient light sensor and touch controller are separately packaged, then each component can be optimized independently, but device size and cost increase
Solution Approach 1:
The patent combines the ambient light sensor and touch controller into a single integrated package, merging two previously separate components into one unified structure. This integration reduces the overall device footprint while maintaining the functional capabilities of both components, directly addressing the contradiction between component optimization and device size.
Solution Approach 2:
The integrated package performs multiple functions simultaneously - ambient light detection, touch sensing, and data processing - within a single component structure. This multi-functionality allows the device to achieve the capabilities of separate components while occupying less space, resolving the contradiction between functional optimization and compact size.
2Ease of manufacture
If ambient light sensor and touch controller are separately packaged, then assembly flexibility is maintained, but manufacturing cost increases
Solution Approach 1:
By merging the ambient light sensor and touch controller into a single packaged component, the patent reduces the total number of parts that need to be manufactured, handled, and assembled. This consolidation lowers manufacturing complexity and material requirements while maintaining ease of integration through a unified package structure.
3Adaptability or versatility
If separate packaging is used for ALS and touch controller, then component selection flexibility is maintained, but device complexity increases
Solution Approach 1:
The integrated package provides universal functionality by incorporating both ambient light sensing and touch control capabilities in a single component. This multi-functional design simplifies system integration by reducing the number of separate components that need to be coordinated, thereby decreasing device complexity while maintaining adaptability through the unified package architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration provides space and cost savings while enabling advanced sensing capabilities, such as SAR proximity sensing, ambient light adjustment, and closure detection, enhancing the functionality of compact electronic devices without increasing their size or complexity.
Implementation Method 1
an ambient light sensor configured to detect ambient light
Implementation Method 2
the capacitive sensor device determines the presence, location and/or motion of one or more input objects
Implementation Method 3
the controller configured to obtain inductance information for inductive sensing
Data Source
AI summary
A touchscreen display device includes: a display; a flexible printed circuit; touch sensing electrodes connected to the flexible printed circuit; and a multi-functional ambient light sensor package mounted on the flexible printed circuit. The multi-functional ambient light sensor package includes: an ambient light sensor; transmitter and receiver circuitry connected to the touch sensing electrodes via the flexible printed circuit; and a controller configured to obtain capacitance information from the touch sensing electrodes and ambient light information from the ambient light sensor via a single chip. The multi-functional ambient light sensor package may be packaged as a wafer-level chip-scale package (WLCSP).