AlSiC Thermal Management with Pyrolytic Graphite Inserts
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Solution Overview
Problem
High heat generating power electronics face inefficiencies in thermal management due to thermal resistance in conventional heat sinks, particularly at high power densities, where existing thermal interface materials hinder effective heat transfer from devices to cooling systems.
Innovation Solution
A metal matrix composite (AlSiC) with integrated high thermal conductivity pyrolytic graphite (HTC-PG) and pressure-assisted aluminum interfaces, incorporating cooling channels and dielectric substrates to minimize thermal resistance and enhance heat dissipation, allowing for efficient heat transfer to liquid cooling streams.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional thermal interface materials are used between heat sink and power module, then ease of assembly is improved, but thermal resistance increases significantly
Solution Approach 1:
The patent removes the thermal interface material layer from the thermal path by directly bonding the aluminum heat sink base to the power module base through pressure-assisted bonding. This extraction eliminates the thermal resistance introduced by TIM while maintaining ease of assembly through the bonding process.
Solution Approach 2:
The patent merges the heat sink base directly with the power module base through pressure-assisted bonding, creating a unified thermal path. This merging eliminates the interface between separate components (heat sink base + TIM + power module base) and establishes direct thermal contact, reducing thermal resistance while maintaining assembly simplicity.
2Loss of energy
If more cooling tubes are added to heat sink, then heat dissipation capacity is improved, but device complexity increases
Solution Approach 1:
The patent introduces pyrolytic graphite inserts with high thermal conductivity specifically at locations where heat dissipation is most needed - directly beneath the power module heat-generating areas. This local enhancement of thermal conductivity allows fewer cooling tubes to achieve the same heat dissipation capacity, reducing device complexity while maintaining effective heat removal.
Solution Approach 2:
The patent uses pyrolytic graphite, a composite material with exceptional in-plane thermal conductivity, to create efficient heat spreading paths. This composite material approach enables effective heat dissipation with a reduced number of cooling tubes, simplifying the overall device structure while maintaining high heat dissipation capacity.
3Weight of moving object
If aluminum heat sink base is used instead of copper, then weight is reduced, but thermal conductivity decreases
Solution Approach 1:
The patent creates a composite thermal management system combining aluminum heat sink base with pyrolytic graphite inserts. The aluminum provides lightweight structural support while the pyrolytic graphite inserts provide high thermal conductivity pathways, achieving a balance between weight reduction and thermal performance enhancement.
Solution Approach 2:
The patent enhances the thermal conductivity of the aluminum heat sink base locally by embedding pyrolytic graphite inserts at critical heat transfer locations. This localized enhancement allows the use of lighter aluminum material while maintaining effective thermal conductivity where it is most needed for heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces thermal resistance and improves overall thermal dissipation performance, enabling higher power densities and extended device lifespan by optimizing the thermal path and material assembly in high heat generating electronics.
Implementation Method 1
Pyrolytic Graphite insert or sheet having a high degree of thermal conductivity... The heat generating device is positioned on the metal matrix composite top surface in a substantially parallel relationship with the Pyrolytic Graphite insert surface area for maximum heat transfer efficiency
Implementation Method 2
The cooling channels confine the flow of liquid coolant within the MMC... Some substance in liquid form, such as water, is passed through the tubes
Data Source
AI summary
The present invention is a system for cooling high power, heat generating devices. The system includes a metal matrix composite (AlSiC) having a coefficient of thermal expansion substantially equal to that of the heat generating device. The metal matrix composite (MMC) includes interior cooling channels and at least one Pyrolytic Graphite insert laterally positioned against the cooling channels. The heat generating device is placed on the metal matrix composite top surface in a substantially parallel relationship with the Pyrolytic Graphite insert surface area for maximum heat transfer efficiency.