AlSiC Stiffener Sealing Structure for Warpage-Controlled Liquid Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Electronic component packages experience warpage due to temperature differentials caused by varying thermal coefficients of expansion, which is exacerbated by the use of direct liquid cooling, leading to structural instability and potential damage.
Innovation Solution
A weight-optimized stiffener made of silicon carbide particles in an aluminum matrix, with an irregularly shaped outer periphery and geometric features, provides warpage control while enabling direct liquid cooling by using an adhesive to couple a substrate and incorporating a manifold for coolant distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a traditional stiffener is used to control warpage, then structural stability is improved, but thermal mass and weight concentration increase
Solution Approach 1:
The stiffener is constructed from silicon carbide particles embedded in an aluminum matrix, creating a composite material that combines the high thermal conductivity and stiffness of silicon carbide with the low density and cost-effectiveness of aluminum. This composite structure achieves the required structural stability and warpage control while maintaining low thermal mass and weight.
2Temperature
If direct liquid cooling is implemented, then heat transfer efficiency is improved, but warpage and structural instability worsen
Solution Approach 1:
The stiffener incorporates localized geometric features including recesses positioned to receive protrusions from the substrate, and protrusions that extend adjacent to outer side surfaces of the substrate. These localized structural modifications provide targeted reinforcement at critical areas experiencing thermal stress, enabling effective warpage control in direct liquid cooling applications without requiring a uniformly heavy structure.
3Weight of moving object
If weight optimization is applied to the stiffener, then thermal mass is reduced, but structural strength may deteriorate
Solution Approach 1:
The silicon carbide aluminum composite material provides high strength-to-weight ratio, maintaining structural integrity while minimizing thermal mass.
Solution Approach 2:
The stiffener features recesses and protrusions that provide localized reinforcement at critical stress points, allowing weight reduction in non-critical areas while maintaining structural strength where needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The stiffener effectively controls warpage and facilitates efficient heat transfer, reducing thermal mass and weight concentration, ensuring structural integrity and compatibility with high-density computing environments.
Implementation Method 1
a portion of a substrate coupled to the bottom surface of the stiffener by an adhesive
Implementation Method 2
The weight optimization of the stiffener reduces its thermal mass and the impact of weight concentrations during attachment of the stiffener to a circuit assembly
Data Source
AI summary
A weight optimized stiffener for use in a semiconductor device is disclosed herein. In one example, the stiffener is made of AlSiC for its weight and thermal properties. An O-ring provides sealing between a top surface of the stiffener and a component of the semiconductor device and adhesive provides sealing between a bottom surface of the stiffener and another component of the semiconductor device. The stiffener provides warpage control for a lidless package while enabling direct liquid cooling of a chip or substrate.