AlSiC Stiffener and Sealing Layout for Lidless Liquid-Cooled Modules
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High power density and thermal challenges in data centers due to temperature differentials in electronic component packages, leading to warpage issues, which are not effectively addressed by existing technologies.
Innovation Solution
A weight-optimized stiffener made of silicon carbide particles in an aluminum matrix, with specific geometric features for reduced thermal mass and weight optimization, providing warpage control for lidless packages while enabling direct liquid cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a traditional stiffener is used in electronic component packages, then structural support and warpage control are provided, but the thermal mass is high and weight concentrations cause thermal management challenges
Solution Approach 1:
The stiffener is constructed from aluminum alloy, a composite material that provides high strength-to-weight ratio. This allows the stiffener to maintain structural support and warpage control capabilities while significantly reducing thermal mass compared to traditional materials, thereby resolving the contradiction between strength and weight
Solution Approach 2:
The patent modifies the stiffener's geometric parameters including thickness, shape, and positioning to optimize the balance between structural support and thermal mass. By adjusting these parameters, the stiffener maintains adequate warpage control while minimizing weight concentrations that would hinder thermal management
2Productivity
If high power density components are used to increase compute performance, then energy efficiency and compute density improve, but thermal challenges and temperature differentials increase causing warpage
Solution Approach 1:
The stiffener incorporates segmented or distributed support structures rather than a single monolithic component. This segmentation allows for better heat distribution and reduced localized thermal stress, addressing the warpage issue caused by temperature differentials while maintaining high compute density
Solution Approach 2:
The stiffener design applies different properties or configurations in different regions to address local thermal conditions. Areas with higher heat generation receive enhanced support or thermal management features, while cooler regions use lighter structures, thereby managing temperature differentials effectively
3Temperature
If lidless package design is used for direct liquid cooling, then thermal management improves, but warpage control becomes more difficult
Solution Approach 1:
The stiffener acts as an intermediary component between the lidless package structure and the liquid cooling system. It provides the necessary structural support and warpage control that would otherwise be provided by a lid, while allowing direct liquid cooling to function effectively
Solution Approach 2:
The stiffener performs multiple functions simultaneously: it provides structural support, controls warpage, and facilitates thermal management in the lidless package design. This multi-functionality resolves the contradiction by making the single component adequate for both mechanical and thermal requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively controls warpage and enhances thermal management in high-density server environments, improving compute performance and energy efficiency while reducing material costs and thermal stresses.
Implementation Method 1
Due to differences in the thermal coefficient of expansion (CTE) of the various package components, the electronic component package may warp as the temperature of the electronic component package changes
Implementation Method 2
Because liquid is many times better at storing and transferring heat than air, liquid cooling solutions can provide immediate and measurable benefits to compute efficiency, density and performance
Data Source
Figure 1
Figure 2A~2D
Figure 3A~3B
AI summary
A weight optimized stiffener for use in a semiconductor device is disclosed herein. In one example, the stiffener is made of AlSiC for its weight and thermal properties. An O-ring provides sealing between a top surface of the stiffener and a component of the semiconductor device and adhesive provides sealing between a bottom surface of the stiffener and another component of the semiconductor device. The stiffener provides warpage control for a lidless package while enabling direct liquid cooling of a chip or substrate.