Alternately Stacked Die Package Thermal Dissipation
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Solution Overview
Problem
Conventional stacked die IC packages face limitations in thermal dissipation, leading to heat accumulation and premature failure due to restricted integration of different die types and sizes, with existing thermal management solutions being costly and less effective.
Innovation Solution
The implementation of a microelectronic device package with stacked die arranged in alternating orientations, featuring laterally spaced die and strategically positioned gaps to facilitate heat dissipation, along with the use of retention materials and thermally conductive structures to enhance thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional stacked die configurations are used with die stacked directly on top of one another, then integration density is improved, but thermal dissipation capability deteriorates leading to heat accumulation
Solution Approach 1:
The patent segments the stacked die structure by introducing lateral spacing between die in the same layer, creating gaps that allow thermal pathways. Instead of continuous stacking, the die are divided into laterally spaced positions, enabling heat to dissipate through the gaps rather than being trapped between closely stacked die.
Solution Approach 2:
The patent transitions from purely vertical stacking to a three-dimensional arrangement where die are positioned with lateral offsets. By alternating the lateral positions of die in adjacent layers, the structure creates diagonal and lateral thermal pathways in addition to vertical ones, effectively using multiple dimensions for heat dissipation while maintaining high integration density.
2Ease of manufacture
If conventional stacked die configurations are used, then manufacturing simplicity is improved, but flexibility in integrating different die types and sizes deteriorates
Solution Approach 1:
The patent employs asymmetric positioning of die in alternating layers, where die in one layer are laterally offset relative to die in adjacent layers. This asymmetric arrangement allows die of different sizes and types to be integrated flexibly while maintaining a relatively simple manufacturing process, as the alternating pattern provides natural alignment references.
3Temperature
If thermal interface materials and thermally conductive encapsulant are used to mitigate heating problems, then thermal dissipation is improved, but package cost increases
Solution Approach 1:
The patent enables the stacked die structure itself to serve the thermal management function through its geometric arrangement. The alternating lateral positions create inherent thermal pathways and gaps that facilitate heat dissipation without requiring additional thermal interface materials or conductive encapsulant, thereby reducing package cost while maintaining effective thermal dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for improved thermal dissipation and flexibility in integrating multiple die types, reducing the risk of heat-related failures and enhancing the reliability of the package by effectively managing heat generation across various thermally active regions.
Implementation Method 1
strategically positioned gaps to facilitate heat dissipation
Implementation Method 2
gaps to facilitate heat dissipation
Implementation Method 3
thermally conductive structures to enhance thermal management
Data Source
AI summary
A microelectronic device package including multiple layers of stacked die. Multiple die layers in the package can include two or more die. At least two die in a first layer will be laterally spaced from one another to define a first gap extending in a first direction; and at least two die in a second layer will be laterally spaced from one another to define a second gap extending in a second direction that is angularly offset from the first direction. The first and second directions can be perpendicular to one another.