Alternating-Fin Copper Microcooler for Lower Thermal Resistance
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Solution Overview
Problem
Current copper microcoolers face limitations in reducing thermal resistance due to constraints in channel/fin width reduction, which can be achieved only at increased costs using silicon processing and wafer bonding.
Innovation Solution
A copper microcooler device with alternating fin widths is fabricated by forming a first set of fins in a copper substrate, depositing an alternative metal on these fins, filling the channels with copper, and selectively etching to create a second set of fins, thereby increasing the number of channels and reducing thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If channel/fin width is reduced to lower thermal resistance, then thermal resistance decreases, but manufacturing complexity and cost increase due to requiring silicon processing and wafer bonding
Solution Approach 1:
The microcooler structure is segmented into alternating first and second fins with different widths, allowing the creation of multiple channel widths within a single copper substrate. This segmentation enables increased channel density without requiring complex silicon processing or wafer bonding, thus reducing thermal resistance while maintaining manufacturing simplicity
Solution Approach 2:
Different regions of the microcooler are given different fin widths to optimize local thermal characteristics. The alternating pattern of narrow and wide fins creates channels of varying widths, with narrower channels providing enhanced cooling where needed while wider channels maintain adequate flow paths, all within a uniform copper manufacturing process
2Productivity
If channel/fin width is reduced to increase number of channels, then number of channels increases, but manufacturing precision requirements increase
Solution Approach 1:
The fin structure is divided into two distinct sets with different widths, allowing the manufacturing process to target achievable precision levels for each set separately. The first fins serve as reference structures, and the second fins are formed relative to them, enabling increased channel count without requiring ultra-precise single-step fabrication
Solution Approach 2:
The first set of fins is formed first to establish a reference pattern in the copper substrate. This preliminary structure guides the subsequent formation of the second fins, allowing the manufacturing process to achieve the desired alternating pattern with standard precision rather than requiring higher precision in a single step
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach achieves nearly twice the number of channels with narrower widths, enhancing thermal characteristics and reducing thermal resistance, improving cooling efficiency for electronic components.
Implementation Method 1
A copper microcooler device with alternating fin widths is fabricated by forming a first set of fins in a copper substrate... enhancing thermal characteristics and reducing thermal resistance
Data Source
AI summary
A microcooler device and formation thereof. The microcooler device includes: a first set of fins having a first fin width; a second set of fins having a second fin width, wherein the first set of fins alternate between the second set of fins; and a set of channels located between the first set of fins and the second set of fins.