Alternating Layer Mounting Device for Electronic Components
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Solution Overview
Problem
Mounting devices face challenges in achieving both effective heat dissipation and mechanical stability, especially with the increasing miniaturization and power of electronic components, as thermally conductive materials tend to become mechanically unstable and support structures may not adequately handle heat removal.
Innovation Solution
A mounting device is designed as an alternating stack of mechanically robust support structures and thermally conductive, electrically insulating structures, such as diamond-like carbon, to simultaneously enhance heat removal and mechanical stability, with the support structures also serving as adhesion promoters for the insulating materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermally conductive materials are used to improve heat dissipation, then thermal conductivity is improved, but mechanical stability deteriorates
Solution Approach 1:
The patent employs a composite structure consisting of alternating layers of thermally conductive material (such as diamond-like carbon or aluminum nitride) and mechanically stable support structures (such as silicon dioxide or glass). This composite architecture allows the thermally conductive layers to efficiently dissipate heat while the support structures provide the necessary mechanical stability, thereby resolving the contradiction between thermal conductivity and mechanical stability.
Solution Approach 2:
The mounting device is segmented into multiple alternating layers of thermally conductive material and support structures. Each layer performs its specific function: thermally conductive layers for heat dissipation and support structures for mechanical stability. This segmentation allows both requirements to be satisfied simultaneously by distributing functions across different layers rather than requiring a single material to fulfill both roles.
2Stability of the object's composition
If support structures are used to improve mechanical stability, then mechanical stability is improved, but heat removal capability deteriorates
Solution Approach 1:
The alternating layer structure creates a composite material system where support structures provide mechanical stability and thermally conductive layers provide heat removal capability. The close integration of these different materials in alternating layers ensures that heat can be effectively removed through the thermally conductive paths while the support structures maintain structural integrity.
Solution Approach 2:
By segmenting the mounting device into alternating functional layers, the patent enables heat removal and mechanical support to occur simultaneously through different layers. The thermally conductive layers are positioned to conduct heat away from heat-generating components, while support structures provide mechanical reinforcement, allowing both functions to be optimized independently yet work together as an integrated system.
3Temperature
If thermally conductive structures are made thicker to improve heat dissipation, then thermal conductivity is improved, but mechanical stability deteriorates
Solution Approach 1:
Instead of using a single thick layer of thermally conductive material that would compromise mechanical strength, the patent segments the thermal management function into multiple thinner alternating layers of thermally conductive material and support structures. This segmentation allows sufficient thermal conductivity to be achieved through the cumulative effect of multiple thermal layers while the interspersed support structures maintain mechanical strength.
Solution Approach 2:
The composite alternating layer structure enables the system to achieve high thermal conductivity without requiring any single layer to be excessively thick. The thermally conductive layers can be optimized for thermal performance while the support structure layers provide mechanical reinforcement, creating a balanced composite material system where neither function compromises the other.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for efficient heat spreading and distribution while maintaining mechanical robustness, even under harsh conditions, by optimizing the thickness and material selection of both support and thermally conductive layers.
Implementation Method 1
thermally conductive and electrically insulating structures
Implementation Method 2
such as diamond-like carbon
Data Source
AI summary
A mounting device for mounting electronic components, wherein the mounting device comprises a stack, in particular a layer stack configured as alternating sequence of at least one support structure for providing mechanical support and a plurality of thermally conductive and electrically insulating structures.