Alternating Semiconductor Module Layout for Heat Dissipation
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Solution Overview
Problem
Conventional power conversion devices require excessive space for heat dissipation due to the concentration of heat in specific locations, limiting their ability to efficiently manage heat dissipation while maintaining a compact size, especially when using multiple semiconductor modules in parallel.
Innovation Solution
The design incorporates multiple semiconductor modules with alternating P-side and N-side substrates disposed along a crossing line segment, ensuring that non-driving modules are adjacent to driving modules to dissipate heat effectively, thereby reducing the required space and enhancing heat dissipation properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multiple semiconductor modules are disposed adjacent to each other to reduce device size, then the device size is reduced, but heat dissipation property deteriorates due to heat concentration
Solution Approach 1:
The semiconductor modules are segmented into alternating P-side and N-side substrates, with each substrate containing specific circuit components. This segmentation allows heat to be distributed across multiple substrates rather than concentrated in one location, resolving the contradiction between compact size and heat dissipation.
Solution Approach 2:
The patent employs asymmetric arrangement where P-side and N-side substrates are alternately disposed in a specific pattern. This asymmetric configuration ensures that heat-generating components are distributed non-uniformly across the device, preventing heat concentration while maintaining compact dimensions.
2Device complexity
If a single element is used to obtain the target rated current, then the module structure is simple, but the heat dissipation property deteriorates due to heat concentration at a certain location
Solution Approach 1:
Instead of using a single element, the patent divides the power semiconductor module into multiple elements (P-side and N-side substrates with different circuit configurations). This segmentation distributes heat generation across multiple locations, improving heat dissipation while maintaining relatively simple module structure.
3Power
If semiconductor modules are arranged in parallel to increase current capacity, then the current capacity is increased, but the device size increases due to required spacing for heat dissipation
Solution Approach 1:
The patent merges P-side and N-side substrates in an alternating arrangement, allowing parallel-connected semiconductor modules to be disposed closely together. The complementary nature of P-side and N-side circuits enables this merging, increasing current capacity without proportionally increasing device size.
Solution Approach 2:
The patent arranges semiconductor modules in an alternating pattern that utilizes two-dimensional space more efficiently. By disposing P-side and N-side substrates alternately in specific directions, the design maximizes space utilization while maintaining adequate thermal management, allowing parallel modules to be closer together.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat dissipation efficiency while minimizing the overall size of the power conversion device, preventing heat interference and allowing for optimal customizability and reduced mounting restrictions.
Implementation Method 1
the first circuit does not drive when the second circuit is driving, the second circuit does not drive when the first circuit is driving, the first member and the second member of each of the semiconductor modules are disposed adjacent to each other along a first direction being a longitudinal direction of the semiconductor module as seen in a plan view
Data Source
AI summary
A first member of a first semiconductor module and a second member of a second semiconductor module are disposed adjacent to each other along a crossing line segment crossing a longitudinal direction of the first semiconductor module as seen in a plan view. The first member is provided with a first circuit. The second member is provided with a second circuit. The first circuit does not drive when the second circuit is driving. The second circuit does not drive when the first circuit is driving.