Alternating Substrate Rotation Speed for Liquid Distribution
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Solution Overview
Problem
Current substrate treatment processes, such as deposition and etching, face inefficiencies in coating uniformity and treatment liquid usage, particularly in rotating substrates at constant speeds, which can lead to suboptimal treatment efficiency and excessive liquid consumption.
Innovation Solution
A method and apparatus that alternately rotate substrates at varying speeds, with the second speed being significantly higher than the first, while supplying treatment liquids, to enhance treatment efficiency and reduce liquid usage by controlling rotational speed changes and acceleration during coating and etching processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the substrate rotates at a constant speed while treatment liquid is supplied, then the coating process is simple to control, but the treatment efficiency is insufficient and excessive treatment liquid is consumed
Solution Approach 1:
The substrate rotation speed is dynamically changed between a first speed (100 rpm or lower, including 0 rpm) and a second speed (1000 rpm or higher) during the treatment liquid supply process. This dynamic speed adjustment optimizes both treatment efficiency and liquid consumption by alternating between speeds that promote liquid distribution and speeds that enhance reaction time
Solution Approach 2:
The substrate rotation speed is periodically changed between the first speed and the second speed multiple times (two times or more) during the treatment process. This periodic alternation creates optimal conditions for both liquid distribution and chemical reaction at different time intervals, resolving the contradiction between treatment efficiency and liquid consumption
2Speed
If the substrate rotates at high speed, then the treatment liquid is distributed quickly across the surface, but the reaction time between the treatment liquid and substrate is reduced
Solution Approach 1:
The substrate rotation speed alternates between a first speed (100 rpm or lower, including 0 rpm) and a second speed (1000 rpm or higher) during treatment liquid supply. The high speed phase quickly distributes the liquid across the substrate surface, while the low speed phase provides sufficient reaction time, achieving both objectives through periodic alternation
Solution Approach 2:
The rotation speed is dynamically adjusted during the treatment process, transitioning between high and low speeds multiple times. This dynamic control allows the system to optimize liquid distribution speed and reaction time at different stages of the treatment process
3Duration of action of moving object
If the substrate rotates at low speed, then the reaction time between treatment liquid and substrate is extended, but the liquid distribution across the substrate surface becomes insufficient
Solution Approach 1:
The substrate rotation speed periodically alternates between a first speed (100 rpm or lower, including 0 rpm) and a second speed (1000 rpm or higher). During the low speed phase, sufficient reaction time is provided, while the high speed phase ensures complete liquid distribution across the substrate surface
Solution Approach 2:
The rotation speed is dynamically controlled to switch between low and high speeds during treatment liquid supply. This dynamic adjustment ensures that both liquid distribution and reaction time requirements are met at different stages of the treatment process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves treatment efficiency by ensuring thorough liquid distribution and reaction time, while minimizing the amount of treatment liquid required, thereby optimizing the substrate treatment process.
Implementation Method 1
repeatedly rotating the substrate alternately at a first speed and at a second speed while the treatment liquid is supplied
Data Source
AI summary
Disclosed are an apparatus and a method for treating a substrate. The method includes repeatedly rotating the substrate alternately at a first speed and at a second speed while the treatment liquid is supplied, and the second speed is higher than the first speed.