Alternating Thermal and Adhesive Interface Materials for Semiconductor Packages

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Solution Overview

Problem

Conventional semiconductor packages face heat emission efficiency issues due to poor adhesion of thermal interface materials, leading to delamination of the heat emitting lid from the semiconductor chip, which reduces heat dissipation effectiveness.

Innovation Solution

A combination of high heat transmission efficiency thermal interface material and a highly adhesive interface material is applied to the semiconductor chip, with the adhesive material applied to specific regions to ensure strong adhesion and fixation of the heat emitting lid, preventing delamination and enhancing heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If epoxy resin based thermal interface material is applied to achieve high heat transmission efficiency, then heat emission efficiency is improved, but adhesion performance deteriorates leading to delamination

Engineering Contradiction:

Improveheat transmission efficiencyVSAvoidadhesion performance

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The interface material is segmented into two distinct types: a thermal interface material for heat transmission and an adhesive interface material for bonding. These are applied in alternating regions on the semiconductor chip surface, allowing each material to perform its specialized function without compromise.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the semiconductor chip surface are assigned different material properties. Regions requiring heat transmission receive thermal interface material, while regions requiring bonding receive adhesive interface material. This local differentiation resolves the contradiction between heat transmission and adhesion.

Inventive Principle:

Principle #3Local quality

2Temperature

If heat emitting lid is tightly fixed to semiconductor chip to improve heat emission, then heat dissipation is enhanced, but delamination occurs at corner regions reducing reliability

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidbonding stability

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The bonding interface is segmented into multiple adhesive regions distributed across the semiconductor chip surface. These adhesive regions provide localized bonding points that collectively secure the heat emitting lid while accommodating thermal expansion differences and preventing delamination at corner regions.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Adhesive interface material is applied beforehand in strategic regions to prevent delamination. This pre-applied adhesive creates a buffer that compensates for thermal stress and mechanical deformation that would otherwise cause the heat emitting lid to delaminate during operation.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

3Reliability

If adhesive interface material is applied to enhance bonding, then adhesion is improved, but heat transmission efficiency may be reduced

Engineering Contradiction:

Improveadhesion strengthVSAvoidheat transmission efficiency

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

Adhesive interface material is applied only in specific local regions where bonding is critical, rather than covering the entire surface. This localized application maintains strong adhesion where needed while minimizing the impact on overall heat transmission pathways.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The interface structure uses a composite arrangement of different interface materials (thermal and adhesive) in alternating regions. This composite approach allows the system to simultaneously achieve both high adhesion strength and high heat transmission efficiency by leveraging the complementary properties of different materials in different locations.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively maintains the heat emitting lid in a tightly adhered state, improving the reliability and efficiency of heat emission from the semiconductor package by preventing delamination and ensuring consistent heat transfer.

Implementation Method 1

an epoxy resin based thermal interface material 18 having high heat transmission efficiency is applied to the top surface of the semiconductor chip 14

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a highly adhesive interface material is applied to a partial region of the top surface of the semiconductor chip 14

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentUS8981550B2Semiconductor package with alternating thermal interface and adhesive materials and method for manufacturing the same

Publication Date: 2015.03.17 AMKOR TECH SINGAPORE HLDG PTE LTD

AI summary

A semiconductor package improves reliability of heat emitting performance by maintaining a heat emitting lid stacked on a top surface of a semiconductor chip at a tightly adhered state. A highly adhesive interface material and a thermal interface material are applied to the top surface of the semiconductor chip. The highly adhesive interface material insures that the heat emitting lid is bonded to the top surface while the thermal interface material insures excellent heat transfer between the top surface and the heat emitting lid.