Alternating Via Holes Reduce Contact Resistance in Display Devices
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Solution Overview
Problem
Existing display devices face challenges in efficiently connecting signal lines and signal input lines due to increased area requirements and high contact resistance, which affects the transmission of gate and data signals.
Innovation Solution
A display device design featuring a substrate with signal lines and signal input lines connected through alternately arranged first and second contact holes, with a connecting member on the second insulating layer, minimizing area increase and reducing contact resistance by exposing portions of the lines and using conductive materials like aluminum, silver, or indium tin oxide for efficient signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional connection methods are used to connect signal lines and signal input lines, then the connection is established, but the contact resistance is high and the area occupied is large
Solution Approach 1:
The patent transitions from planar contact holes to three-dimensional via holes that penetrate through insulating layers. The via holes are formed with specific depth-to-diameter ratios and are filled with conductive material to create low-resistance vertical connections between signal lines at different levels, effectively reducing contact resistance while occupying minimal horizontal space
Solution Approach 2:
The patent implements a multi-layer insulating structure where first insulating layers and second insulating layers are stacked vertically. Contact holes penetrate through these nested layers to establish connections, allowing multiple signal lines to be connected in a compact vertical arrangement rather than spreading out horizontally, thus reducing the overall connection area
2Area of stationary object
If the connection structure is simplified to reduce area, then the area occupied is minimized, but the contact resistance increases
Solution Approach 1:
The patent uses composite connection structures consisting of conductive material filled within insulating material. The via holes are filled with highly conductive materials such as copper or aluminum, while the surrounding insulating layers provide structural support and electrical isolation. This composite approach achieves low contact resistance within a compact footprint
Solution Approach 2:
The connection path is segmented into multiple vertical sections through the stacked insulating layers. Each via hole represents a discrete connection segment, and multiple such segments can be arranged in parallel to reduce overall resistance while maintaining compact area. The segmentation allows optimized design of each connection point independently
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces contact resistance and minimizes area increase, enhancing the transmission of clock signals and gate signals, thereby improving the overall performance and efficiency of the display device.
Implementation Method 1
A connecting member connects the signal line and the signal input line through the plurality of first contact holes and the plurality of second contact holes
Data Source
AI summary
A display device includes a signal line disposed on a substrate. A signal input line is disposed on the substrate and connected to a driver. A first insulating layer is disposed on the signal line. A second insulating layer is disposed on the signal input line and the first insulating layer. First contact holes penetrate the first insulating layer and the second insulating layer and expose a portion of the signal line. Second contact holes penetrate the second insulating layer and expose a portion of the signal input line. A connecting member connects the signal line and the signal input line through the first and the second contact holes and is disposed on the second insulating layer. The first and the second contact holes are alternately arranged in the second insulating layer.