Alumina Interposer Assembly for Deflection-Resistant Electronic Components
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Solution Overview
Problem
Existing electronic components with interposer boards made of glass epoxy resin are not sufficiently resistant to deflection, leading to noise generation due to vibration propagation.
Innovation Solution
An electronic component design featuring an alumina interposer board with a smaller size than the electronic element, including a Cu fired layer, Zn-containing layer, and a recess for improved adhesion and aesthetics, along with an electrically conductive resin layer for shock absorption, to enhance resistance to deflection and reduce noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If an interposer board made of glass epoxy resin is used, then the electronic component can be manufactured with conventional materials and processes, but the interposer board is not sufficiently resistant to deflection and vibrations propagate causing noise
Solution Approach 1:
The patent changes the material parameter of the interposer board from glass epoxy resin to alumina (aluminum oxide). This material substitution fundamentally alters the mechanical properties, providing significantly higher deflection resistance and vibration damping characteristics, thereby eliminating noise generation while maintaining manufacturing feasibility through established alumina board fabrication processes
Solution Approach 2:
The patent employs alumina as a ceramic material with inherent composite-like properties, combining high strength, stiffness, and vibration damping characteristics. The alumina board acts as a composite structure that simultaneously provides mechanical support and noise reduction, resolving the contradiction between deflection resistance and noise prevention
2Area of stationary object
If the interposer board size is reduced to be smaller than the electronic element, then the board can fit within the component structure and improve aesthetics, but the bonding area is reduced
Solution Approach 1:
The patent applies local quality by concentrating the bonding function at specific locations rather than distributing it uniformly. The alumina board includes protrusions that locally increase bonding area and strength at critical interfaces, allowing the overall board size to be reduced while maintaining reliable mechanical and electrical connections through strategically positioned bonding zones
Data Source
AI summary
An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at multilayer body end surfaces and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surfaces and the board side surfaces. One of the board main surfaces is in a vicinity of the electronic element and is joined with one of the multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. A maximum length of the interposer board is smaller than a length of the electronic element. A width of the interposer board is smaller than a width of the electronic element.