Aluminium Adhesion Structures for Semiconductor Package Delamination
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Solution Overview
Problem
Current semiconductor packages face challenges in mechanical integrity, particularly in terms of delamination between the surface and dielectric structures, which can lead to moisture ingress and electrical performance issues.
Innovation Solution
The implementation of hydrothermally formed adhesion enhancing structures, such as aluminium oxide or aluminium hydroxide fibers, on aluminium-based surfaces to create a robust interface between the chip pad and dielectric structures, enhancing mechanical and electrical integrity without requiring hazardous materials like chromium.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional encapsulation methods are used without adhesion enhancing structures, then the manufacturing process is simple, but the mechanical integrity and adhesion between the dielectric structure and the chip pad are insufficient, leading to delamination and moisture ingress
Solution Approach 1:
The patent applies preliminary action by forming adhesion enhancing structures on the chip pad surface before encapsulation. The dendritic structures are created through hydrothermal treatment of aluminium-based surfaces, which grows aluminium oxide or aluminium hydroxide fibers that protrude from the surface. This preliminary surface modification ensures strong adhesion between the dielectric structure and the chip pad, preventing delamination and moisture ingress while maintaining manufacturing simplicity.
2Reliability
If chromium-based adhesion promoters are used, then adhesion between the surface and dielectric structure is improved, but hazardous materials are introduced into the manufacturing process
Solution Approach 1:
The patent converts the naturally occurring aluminium surface into beneficial adhesion structures through hydrothermal treatment. Instead of using hazardous chromium-based adhesion promoters, the process exploits the aluminium content already present in the chip pad to grow aluminium oxide or aluminium hydroxide dendritic structures. This approach eliminates hazardous materials while achieving superior adhesion strength, as the dendritic structures provide mechanical interlocking with the dielectric encapsulant.
3Reliability
If the surface is roughened with adhesion enhancing structures, then delamination is suppressed and mechanical integrity is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The patent replaces complex mechanical surface roughening methods with a chemical-hydrothermal process. Instead of using mechanical abrasion, blasting, or complex coating applications, the invention uses hydrothermal treatment to grow aluminium oxide or aluminium hydroxide dendritic structures on the aluminium-based chip pad surface. This substitution maintains manufacturing simplicity while achieving excellent delamination resistance through the naturally formed dendritic adhesion structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly improves mechanical integrity by suppressing delamination and ensures proper electrical connection, preventing moisture ingress while being environmentally friendly and cost-effective.
Implementation Method 1
adhesion enhancing structures grown via temperature hydrolysis on aluminium based metal areas or Al2O3 layer covered copper areas
Implementation Method 2
the mentioned (preferably aluminium comprising) adhesion enhancing structures on the (preferably aluminium comprising) surface may be manufactured hydrothermally, i.e. by the combination of an aqueous medium and heat
Data Source
AI summary
A package includes an electronic chip having a pad. The pad is at least partially covered with adhesion enhancing structures. The pad and the adhesion enhancing structures have at least aluminium in common.