Aluminosilicate Resin Composition for High Thermal Conductivity PCBs
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Solution Overview
Problem
Thermosetting resin compositions with high inorganic filler content face issues with moldability, mechanical drillability, and dielectric characteristics, particularly with alumina due to hardness and boehmite due to dielectric loss tangent degradation, and existing methods fail to balance heat dissipation, mechanical drillability, and dielectric characteristics effectively.
Innovation Solution
A resin composition incorporating aluminosilicate with specific silicon and aluminum content and particle size, combined with thermosetting compounds like epoxy resin, cyanate compounds, and maleimide compounds, along with a molybdenum compound, to enhance thermal conductivity, mechanical drillability, and dielectric properties while maintaining moldability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the content of inorganic filler in thermosetting resin composition is increased to improve thermal conductivity, then heat dissipation characteristics are improved, but moldability deteriorates and cracks and voids are likely to occur
Solution Approach 1:
The patent applies parameter changes by precisely controlling the particle size distribution of inorganic fillers (D10: 0.1-0.5μm, D50: 1-5μm, D90: 5-20μm) and their content ratios, as well as the resin-to-filler ratio (20-80 mass%), to achieve optimal thermal conductivity while preventing moldability deterioration and defect formation
Solution Approach 2:
The patent uses composite materials by combining multiple types of inorganic fillers with different particle sizes and thermal conductivities (alumina, silica, titania, zirconia, magnesia) within the resin matrix, creating a multi-scale composite structure that improves heat dissipation while maintaining moldability through proper filler distribution
2Temperature
If alumina is used as inorganic filler to improve thermal conductivity, then heat dissipation characteristics are improved, but mechanical drillability deteriorates due to high hardness
Solution Approach 1:
The patent applies local quality by creating a heterogeneous filler distribution where hard alumina particles (0.5-5μm) provide thermal conductivity in specific regions, while softer fillers like silica (0.1-0.5μm) and the resin matrix provide drillability in other regions, achieving local optimization of both properties
Solution Approach 2:
The patent changes the particle size parameters of alumina to a specific range (0.5-5μm) that balances thermal conductivity and drillability, and controls the overall inorganic filler content at 20-80 mass% to prevent excessive hardness while maintaining heat dissipation performance
3Ease of operation
If boehmite is used as inorganic filler to improve mechanical drillability, then processability is improved, but dielectric loss tangent deteriorates
Solution Approach 1:
The patent controls the particle size of boehmite within 0.1-0.5μm and limits its content to 10-50 mass% of total inorganic filler, optimizing the balance between mechanical drillability improvement and dielectric loss tangent minimization
Solution Approach 2:
The patent combines boehmite with other inorganic fillers (alumina, silica, titania, zirconia, magnesia) in specific proportions to create a composite filler system where boehmite provides drillability enhancement while the other fillers maintain acceptable dielectric properties
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves excellent heat dissipation, mechanical drillability, and dielectric characteristics with high glass transition temperature, improving thermal conductivity and electrical properties, making it suitable for high integration and density printed wiring boards.
Implementation Method 1
an inorganic filler (B) containing an aluminosilicate (A) having a silicon atom content of from 9 to 23% by mass, an aluminum atom content of from 21 to 43% by mass, and an average particle diameter (D50) of from 0.5 to 10 μm
Data Source
AI summary
A resin composition including an inorganic filler (B) having an aluminosilicate (A) having a silicon atom content of from 9 to 23% by mass, an aluminum atom content of from 21 to 43% by mass, and an average particle diameter (D50) of from 0.5 to 10 μm; and any one or more thermosetting compounds selected from the group consisting of an epoxy resin (C), a cyanate compound (D), a maleimide compound (E), a phenolic resin (F), an acrylic resin (G), a polyamide resin (H), a polyamideimide resin (I), and a thermosetting polyimide resin (J), wherein a content of the inorganic filler (B) is from 250 to 800 parts by mass based on 100 parts by mass of resin solid content.