Aluminum Alloy Base Board for Semiconductor Module Heat Dissipation

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Solution Overview

Problem

Conventional semiconductor modules face issues with thermal deformation of the base board, requiring two ceramic insulating substrates to prevent warp, which increases manufacturing costs and restricts the size and shape of pin fins, limiting heat dissipation performance.

Innovation Solution

A semiconductor module with a base board made of aluminum alloy, featuring a hollow case design, ceramic insulating substrate, wiring pattern, semiconductor elements, and a sealing resin, where the base board includes a first and second portion with pin fins for improved heat dissipation and corrosion resistance, reducing thermal resistance and manufacturing costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If two ceramic insulating substrates are used to prevent thermal deformation of the base board, then warp prevention is improved, but manufacturing cost increases

Engineering Contradiction:

Improvebase board warp preventionVSAvoidmanufacturing cost

Core Design Contradiction:

Stability of the object's compositionVSEase of manufacture

Solution Approach 1:

The invention extracts the base board function from the ceramic insulating substrate, allowing the base board to be a separate aluminum alloy component. This eliminates the need for two ceramic substrates while maintaining warp prevention through the aluminum alloy's inherent properties and structural design.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The invention changes the material parameter of the base board from ceramic to aluminum alloy, which has different thermal and mechanical properties. This material substitution allows for cost reduction while maintaining or improving warp resistance through optimized aluminum alloy composition and thickness.

Inventive Principle:

Principle #35Parameter changes

2Temperature

If the base board is made thinner to improve heat dissipation, then thermal resistance decreases, but rigidity and corrosion resistance worsen

Engineering Contradiction:

Improveheat dissipation performanceVSAvoidbase board rigidity

Core Design Contradiction:

TemperatureVSStrength

Solution Approach 1:

The invention uses composite material structure by combining aluminum alloy with ceramic insulating substrate in a layered configuration. The aluminum alloy base board provides heat dissipation and corrosion resistance, while the ceramic substrate provides electrical insulation and structural support, allowing thin base board design without sacrificing rigidity.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The invention applies different material properties to different regions and functions: the aluminum alloy base board is optimized for heat dissipation and corrosion resistance, while the ceramic insulating substrate provides mechanical strength and electrical insulation. This local optimization allows thin base board design while maintaining overall structural integrity.

Inventive Principle:

Principle #3Local quality

3Temperature

If conventional materials are used for pin fins, then manufacturing is easier, but heat transfer performance is limited

Engineering Contradiction:

Improveheat transfer performanceVSAvoidpin fin manufacturing flexibility

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The invention changes the material parameter of pin fins from conventional materials to aluminum alloy, which has superior thermal conductivity. This material parameter change improves heat transfer performance while the aluminum alloy's forgeability enables flexible manufacturing of various pin fin geometries including cylindrical and prismatic shapes.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The aluminum alloy base board enhances corrosion resistance and rigidity, allowing for thinner designs and improved heat transfer performance, reducing thermal resistance and manufacturing costs while maintaining structural integrity and heat dissipation efficiency.

Implementation Method 1

the base board being made of an aluminum alloy... heat transfer performance of the base board is improved to improve heat dissipation thereof

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a water-cooling jacket (4) attached to the semiconductor module (100)

Methodology Applied

Scientific EffectForced convection: Forced Convection

Data Source

PatentUS10211122B2Semiconductor module including a case and base board

Publication Date: 2019.02.19 MITSUBISHI ELECTRIC CORP

AI summary

An object of the present invention is to provide a semiconductor module with high heat dissipation at a low cost. A semiconductor module according to the present invention includes: a case having a hollow portion; a base board made of an aluminum alloy having a first portion corresponding to the hollow portion of the case, and a second portion corresponding to a main body portion of the case, the base board being attached to a bottom face of the case via the second portion; a ceramic insulating substrate disposed on the first portion of the base board; a wiring pattern disposed on the ceramic insulating substrate; semiconductor elements disposed on the wiring pattern; metal wiring boards connected to the semiconductor elements; and a sealing resin that seals the hollow portion of the case.