Multi-Layer Plated Aluminum Electrode for Low Resistance Soldering
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Solution Overview
Problem
Conventional methods for connecting electrodes in energy storage devices, such as spot-welding and bolt fastening, result in low jointing strength and high contact resistance when connecting electrodes of different metal species, leading to voltage drops in energy storage devices.
Innovation Solution
Forming a Zn layer or Zn alloy layer on the positive electrode, followed by a Ni layer and a Sn layer, allows for soldering of a negative electrode of a different metal species, enhancing jointing strength and increasing the contact area, thereby reducing contact resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If spot-welding is used to connect electrodes of different metal species, then the connection process is simple, but the jointing strength is low
Solution Approach 1:
The invention uses a composite plating structure consisting of multiple layers (first plating layer, second plating layer, third plating layer) with different material compositions. Each layer is specifically designed to address different requirements: adhesion to base metal, solderability, and mechanical strength, thereby resolving the contradiction between simple connection process and high jointing strength.
Solution Approach 2:
The plating layers act as intermediary materials between the base metal electrodes and the solder. The first plating layer provides adhesion to the base metal, the second plating layer enhances solderability, and the third plating layer provides mechanical strength, thus mediating the connection process to achieve both simplicity and high jointing strength.
2Device complexity
If bolt fastening is used to connect electrodes, then the connection structure is simple, but the contact area is small leading to high contact resistance
Solution Approach 1:
The invention merges the functions of mechanical connection and electrical connection by using soldering to create a unified joint. The plating layers enable the solder to bond both electrodes together while simultaneously providing low contact resistance, thus combining structural simplicity with electrical reliability.
Solution Approach 2:
The multi-layer plating structure is designed to optimize both mechanical bonding and electrical conductivity. The composite material structure allows the joint to achieve both simple connection structure and low contact resistance by distributing different functions across different layers.
3Ease of manufacture
If conventional plating is used on Al electrode, then the manufacturing process is simple, but the solderability with Cu electrode is poor
Solution Approach 1:
The invention applies a composite plating structure with three distinct layers on the Al electrode. The first layer (e.g., Ni or Pd) provides adhesion to Al, the second layer (e.g., Sn or Zn) provides solderability, and the third layer (e.g., Ag or Au) provides enhanced wetting and mechanical properties. This composite structure resolves the contradiction between simple plating process and good solderability.
Solution Approach 2:
Different regions of the plating structure have different local qualities tailored to specific functions. The first plating layer has high adhesion quality for bonding to Al, the second layer has high solderability quality for bonding to Cu, and the third layer has high wetting quality for solder flow. This local quality differentiation resolves the contradiction between manufacturing simplicity and solderability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances jointing strength and reduces contact resistance, ensuring stable voltage supply to energy storage devices without voltage drops, even under repeated charge and discharge cycles.
Implementation Method 1
Zn layer or Zn alloy layer, Ni layer, and Sn layer or Sn alloy layer are formed on a positive electrode containing Al by plating
Implementation Method 2
Zn layer or Zn alloy layer, Ni layer, and Sn layer or Sn alloy layer are formed on a positive electrode containing Al by plating
Implementation Method 3
connecting a positive electrode in which Zn layer or Zn alloy layer, Ni layer, and Sn layer or Sn alloy layer are formed on the positive electrode containing Al by plating and a negative electrode containing Cu by soldering
Data Source
AI summary
An electrode for an energy storage device including a Zn layer or Zn alloy layer, a Ni layer, and a Sn layer or Sn alloy layer formed by plating on a connecting terminal part of a positive electrode composed of Al so that the resistance value at the contacting point is reduced and the voltage of the energy storage device can be effectively supplied without any drop. Accordingly, this electrode can be soldered to a Cu negative electrode, which is composed of metal that is different species from Al, through a Sn layer or a Sn alloy layer so that jointing strength of the Al positive electrode and the Cu negative electrode can be enhanced. The contacting area is increased in comparison with the conventional jointing by spot-welding or conventional fastening by a bolt so that the resistance value at the contacting point is reduced.