Aluminum Electroplating Barrier Layer for Semiconductor Equipment
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Solution Overview
Problem
Conventional methods for forming protective coatings on semiconductor processing equipment, such as PVD and CVD, fail to adequately coat areas with small holes or plenums, leading to porosity and contamination due to trapped halides.
Innovation Solution
Electrochemical deposition of aluminum or aluminum oxide using a non-aqueous solvent and specific precursors like AlCl3 or Al(NO3)3 in an electroplating bath, with post-treatment to enhance coating density and uniformity, particularly in substrates with plenums.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional methods (PVD, CVD, plasma spraying) are used to coat protective layers, then the coating process is simple and fast, but the coating is incomplete in areas with small holes or plenums, leading to porosity and contamination
Solution Approach 1:
The patent replaces conventional mechanical/physical vapor deposition methods with electrochemical deposition. The electroplating bath with non-aqueous solvent and aluminum precursor enables chemical deposition through electrochemical reactions, achieving complete coating penetration into plenums and small holes that mechanical methods cannot reach
Solution Approach 2:
The patent changes the deposition parameters by using non-aqueous solvents (acetonitrile, ethanol, isopropanol) instead of aqueous solutions, and controlling pH (3-7) and temperature (20-40°C) to optimize the electrochemical deposition process. This enables complete and uniform coating formation in complex geometries while maintaining process control
2Manufacturing precision
If anodization or PEO coatings are used to form barrier layers inside holes, then the coating can penetrate into plenums, but the barrier layers include inherent porosity that traps halides and causes contamination
Solution Approach 1:
The patent changes the chemical composition and deposition parameters by using non-aqueous solvents and controlling pH and temperature, which produces a dense, non-porous coating structure. This eliminates the porosity inherent in anodized and PEO coatings, preventing halide trapping and subsequent contamination
Solution Approach 2:
The patent creates a composite protective system with multiple layers: an aluminum-rich inner layer from electrochemical deposition providing density and contamination resistance, and an aluminum oxide outer layer from post-treatment providing corrosion resistance. This composite structure achieves both coating uniformity and contamination prevention
3Productivity
If electrochemical deposition with aqueous solvents is used, then the deposition process is efficient, but the coating quality is poor and porosity remains high
Solution Approach 1:
The patent changes the solvent from aqueous to non-aqueous (acetonitrile, ethanol, isopropanol), which fundamentally alters the deposition mechanism. This produces a dense, low-porosity coating structure while maintaining efficient deposition rates through optimized pH (3-7) and temperature (20-40°C) parameters
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Results in more complete and dense coatings that prevent contamination, offering improved corrosion resistance and protection in plasma environments, with enhanced deposition uniformity and reduced porosity compared to conventional methods.
Implementation Method 1
depositing a coating on the aluminum substrate, the coating comprising aluminum or aluminum oxide
Implementation Method 2
the electroplating batch comprising a non-aqueous solvent and a deposition precursor
Implementation Method 3
post-treating the aluminum substrate having the coating thereon
Data Source
AI summary
The present disclosure generally relates to methods of electro-chemically forming aluminum or aluminum oxide. The methods may include the optional preparation of a an electrochemical bath, the electrodepositon of aluminum or aluminum oxide onto a substrate, removal of solvent form the surface of the substrate, and post treatment of the substrate having the electrodeposited aluminum or aluminum oxide thereon.