Aluminum Heating Device Anodized Insulation Layer
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Solution Overview
Problem
Existing heating devices with metallic carriers require high temperatures for insulation and conductor application, which can cause material stress and warping due to differing expansion coefficients, and may not provide sufficient electrical insulation for safe operation.
Innovation Solution
A method using an aluminum carrier with a galvanically applied anodized layer as electrical insulation, followed by a thin-film or thick-film heating conductor application, and optionally an additional insulation and thickening layer to enhance electrical insulation and thermal resistance, allowing for controlled low-temperature processing to prevent material warping and ensure safe operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high temperature stoving is used to apply thick-film paste insulation layer, then electrical insulation is achieved, but the metallic carrier undergoes material stress and warping due to high temperatures and differing expansion coefficients
Solution Approach 1:
The patent changes the temperature parameter from high (stoving) to low (ambient or slightly elevated), and changes the insulation material from thick-film paste to thin-film coating, thereby achieving electrical insulation without subjecting the metallic carrier to high temperatures that cause warping
Solution Approach 2:
The patent uses a thin-film insulation layer instead of a thick-film layer, reducing the amount of material and the thickness required to achieve sufficient electrical insulation, thereby minimizing thermal mass and reducing stress on the carrier during processing
2Reliability
If thick-film paste is used for insulation layer, then electrical insulation is provided, but the manufacturing process becomes complex and requires high temperature stoving
Solution Approach 1:
The patent replaces the mechanical screen printing process for applying thick-film paste with a thin-film coating process that can be applied by spraying, dipping, or other low-temperature methods, thereby simplifying the manufacturing process and eliminating the need for high-temperature stoving
Solution Approach 2:
The patent uses a thin-film insulation layer instead of a thick-film layer, reducing the amount of material and the thickness required to achieve sufficient electrical insulation, thereby simplifying the overall manufacturing process
3Use of energy by moving object
If aluminum carrier is used for good thermal conductivity, then heating efficiency is improved, but electrical insulation becomes more critical due to aluminum's electrical conductivity
Solution Approach 1:
The patent creates a composite structure with the aluminum carrier providing thermal conductivity and the thin-film insulation layer providing electrical insulation, thereby combining the beneficial properties of both materials without the drawbacks of using either material alone
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a robust, easily manufacturable heating device with improved electrical insulation and thermal conductivity, reducing material stress and enabling safe operation across various applications, including household appliances and cooking equipment.
Implementation Method 1
An anodized layer is generated on the heating conductor side, directly on the carrier and/or on its heating conductor side. This means that there is no further layer provided in between
Implementation Method 2
the carrier is moved with at least its heating conductor side into a galvanic bath having an acid electrolyte
Implementation Method 3
at least one heating conductor applied to the carrier
Data Source
AI summary
A method for manufacturing a heating device having a carrier and at least one heating conductor applied thereto has the steps: provision of a carrier having a heating conductor side, wherein the carrier consists of aluminum, generation of an anodized layer on the heating conductor side, wherein the anodized layer is applied directly to the carrier and/or its heating conductor side, application of the at least one heating conductor above the anodized layer in a thick-film method. Advantageously, the anodized layer can be manufactured as a hard anodized layer. An additional insulation layer and/or a thickening layer can also be applied to the anodized layer.

