Aluminum Material Interposing Layer for Capacitor Dielectric Adhesion
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Solution Overview
Problem
Conventional methods for forming thick dielectric layers on aluminum materials for capacitors and batteries face challenges in maintaining adhesiveness and achieving high capacitance due to defects like cracks, which limit the thickness and performance of the dielectric layer.
Innovation Solution
A mixture layer of dielectric particles including valve metals and a binder is formed on an aluminum material, followed by heating in a hydrocarbon-containing atmosphere to create an interposing layer with aluminum and carbon, enhancing adhesiveness between the aluminum and dielectric layers, allowing for thicker dielectric layers and higher capacitance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the dielectric layer is made thick to increase capacitance, then the capacitance increases, but defects like cracks occur and adhesiveness deteriorates
Solution Approach 1:
An interposing layer is formed between the aluminum substrate and the dielectric layer before the dielectric layer is applied. This preliminary structural preparation prevents defects and maintains adhesiveness even when the dielectric layer is made thick to increase capacitance.
Solution Approach 2:
An interposing layer consisting of aluminum and carbon is introduced as a mediator between the aluminum substrate and the dielectric layer. This intermediary layer prevents crack formation and maintains strong adhesiveness, enabling the use of thicker dielectric layers for higher capacitance without reliability degradation.
2Length of stationary object
If conventional methods are used to form thick dielectric layers, then the dielectric layer thickness increases, but defects like cracks are caused and adhesiveness is weakened
Solution Approach 1:
The interposing layer is formed in advance between the aluminum substrate and the dielectric layer. This preliminary action prevents crack formation during the subsequent dielectric layer formation process, enabling manufacturing of thick dielectric layers with high precision and without defects.
Solution Approach 2:
The interposing layer acts as a protective intermediary that prevents crack formation and maintains manufacturing precision when forming thick dielectric layers. It serves as a buffer that eliminates defect formation during the thickening process.
3Quantity of substance
If the dielectric layer is thickened to achieve high capacitance, then the capacitance increases, but withstanding voltage decreases
Solution Approach 1:
The interposing layer is prepared in advance to provide a stable foundation for the thick dielectric layer. This preliminary structural support maintains withstanding voltage strength even when the dielectric layer is thickened to achieve high capacitance.
Solution Approach 2:
The interposing layer consisting of aluminum and carbon serves as a mediator that maintains electrical strength and withstanding voltage. It prevents breakdown in thick dielectric layers, enabling high capacitance while preserving withstanding voltage capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables excellent adhesiveness and a higher capacitance even with thick dielectric layers, surpassing conventional limits and ensuring reliable performance in capacitors and batteries.
Implementation Method 1
heating in a hydrocarbon-containing atmosphere to create an interposing layer with aluminum and carbon
Implementation Method 2
heating in a hydrocarbon-containing atmosphere to create an interposing layer with aluminum and carbon
Data Source
AI summary
An aluminum material, a dielectric layer and an interposing layer formed in at least one part of a region of the surface of the aluminum material between the aluminum material and the dielectric layer and includes aluminum and carbon, wherein the dielectric layer includes dielectric particles including a valve metal, and an organic substance layer formed on at least one part of a surface of the dielectric particle.