3D Aluminum Package Module Thermal Management
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Solution Overview
Problem
Current semiconductor device packaging faces challenges with resin and ceramic substrates, including high costs, poor thermal and mechanical properties, and difficulties in maintaining flatness and heat radiation, especially with the trend towards lightweight and miniaturized designs.
Innovation Solution
A three-dimensional aluminum package module is developed, featuring an aluminum substrate with an aluminum oxide layer, a semiconductor device mounted in vertically formed openings, and an organic layer covering the device, along with interconnection lines and passive device circuits, which enhances thermal stability and mechanical reliability while allowing for efficient heat radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If resin substrates are used for chip carriers, then ease of manufacture is improved, but thermal reliability and moisture resistance deteriorate
Solution Approach 1:
The patent uses a composite structure combining aluminum substrate with aluminum oxide insulating layer and organic resin layers. The aluminum substrate provides thermal conductivity and mechanical strength, while the aluminum oxide layer provides electrical insulation, creating a composite material system that achieves both thermal reliability and ease of manufacture.
2Reliability
If ceramic substrates are used for chip carriers, then thermal reliability is improved, but manufacturing cost and processing difficulty increase
Solution Approach 1:
The patent replaces expensive ceramic substrates with aluminum substrates that can be mass-produced at lower cost. The aluminum substrate maintains thermal reliability while significantly reducing manufacturing cost and processing complexity compared to ceramic alternatives.
3Reliability
If metallic substrates are used, then thermal reliability is improved, but device complexity increases due to required insulation treatment
Solution Approach 1:
The patent merges the substrate and insulating layer into an integrated structure where the aluminum oxide layer is formed directly on the aluminum substrate through anodization. This combination eliminates the need for separate insulation treatments and reduces device complexity while maintaining thermal reliability.
4Ease of manufacture
If drilling method is used to form cavities in resin substrates, then cavity formation is achieved, but processing time and cost increase
Solution Approach 1:
The patent replaces the mechanical drilling method with a chemical etching process using KOH solution to form cavities in the aluminum substrate. This chemical substitution significantly reduces processing time and cost while achieving precise cavity formation with vertical sidewalls.
5Ease of manufacture
If drilling method is used to form cavities, then cavity formation is achieved, but manufacturing precision deteriorates due to large deviation
Solution Approach 1:
The patent replaces mechanical drilling with chemical etching using KOH solution, which provides isotropic etching with vertical sidewalls. This chemical process achieves superior manufacturing precision with minimal deviation and consistent cavity dimensions compared to mechanical drilling methods.
6Ease of manufacture
If resin substrates are used, then ease of manufacture is improved, but flatness maintenance deteriorates under thermal stress
Solution Approach 1:
The patent uses a composite structure with aluminum substrate providing thermal stability and mechanical strength to maintain flatness under thermal stress. The aluminum oxide layer and organic resin layers are integrated with the aluminum substrate to create a dimensionally stable composite that resists deformation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces package thickness, improves heat radiation performance, minimizes short-circuit risks, and increases integration, offering superior characteristics compared to conventional technologies like LTCC and PCBs.
Implementation Method 1
anodized to form an aluminum oxide layer
Data Source
AI summary
Provided is a three-dimensional aluminum package module including: an aluminum substrate; an aluminum oxide layer formed on the aluminum substrate and having at least one first opening of which sidewalls are perpendicular to an upper surface of the aluminum substrate; a semiconductor device mounted in the first opening using an adhesive; an organic layer covering the aluminum oxide layer and the semiconductor device; and a first interconnection line and a passive device circuit formed on the organic layer and the aluminum oxide layer.