Aluminum PCB Substrates for Appliance Thermal Management
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Solution Overview
Problem
Conventional printed circuit board assemblies (PCBAs) with epoxy resin substrates face challenges in heat dissipation and production efficiency due to inadequate heat dissipation performance and complex, labor-intensive production processes involving different assembly technologies.
Innovation Solution
The use of aluminum PCB substrates with an insulating layer and conductive layer, where through-hole electronic devices are converted to surface-mount devices using machines with surface mount technology and reflow soldering, eliminating the need for manual heat sink installation and enhancing thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If epoxy resin PCB substrates are used, then the PCB structure is stable and easy to manufacture, but the heat dissipation performance is inadequate
Solution Approach 1:
The patent changes the material parameter of the PCB substrate from epoxy resin to aluminum, which fundamentally alters the thermal conductivity parameter. Aluminum substrates provide significantly better heat dissipation performance while maintaining manufacturability through standardized production processes for metal PCBs.
Solution Approach 2:
The patent employs a composite structure consisting of an aluminum substrate combined with insulating layers and conductive layers. This composite material approach allows the PCB to leverage the high thermal conductivity of aluminum while maintaining electrical insulation and circuit functionality through the additional layers.
2Reliability
If through-hole electronic devices are used, then the connection reliability is high, but the production process complexity increases and labor intensity increases
Solution Approach 1:
The patent replaces the mechanical through-hole insertion and soldering process with automated surface-mount technology. Electronic devices are mounted on the surface of the aluminum PCB substrate and connected through conductive layers, eliminating the need for drilling, inserting, and soldering through holes, thereby reducing production complexity and labor intensity.
Solution Approach 2:
The patent changes the mounting parameter of electronic devices from through-hole to surface-mount configuration. This parameter change enables the use of automated pick-and-place machines for device placement and simplifies the connection process while maintaining reliable electrical connections through the conductive layers on the aluminum substrate.
3Temperature
If heat sinks are manually installed, then the heat dissipation is improved, but the production cost increases and defect rates increase
Solution Approach 1:
The patent merges the heat dissipation function directly into the PCB substrate by using an aluminum base material. The aluminum substrate itself acts as the heat sink, eliminating the need for separate heat sink components and their manual installation. This integration maintains effective heat dissipation while streamlining the production process.
Solution Approach 2:
The patent extracts the heat dissipation function from a separate heat sink component and integrates it into the PCB substrate material itself. By taking out the need for additional heat sink parts and their manual assembly, the design simplifies the overall structure and production process while achieving the same or better thermal management performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves heat dissipation efficiency and reduces production costs and defect rates by automating the assembly process, eliminating the need for manual heat sink installation and enhancing thermal conductivity seven to ten times that of epoxy resin substrates.
Implementation Method 1
the aluminum substrate is made of aluminum... enhancing thermal conductivity seven to ten times that of epoxy resin substrates
Implementation Method 2
reflow soldering
Data Source
AI summary
Printed circuit board assembly and method thereof. For example, a printed circuit board assembly includes: an aluminum substrate; an insulating layer on the aluminum substrate; a conductive layer on the insulating layer; and one or more surface-mount electronic devices on the aluminum substrate through the conductive layer and the insulating layer; wherein: the one or more surface-mount electronic devices include at least one converted surface-mount electronic device, the one converted surface-mount electronic device being converted from a through-hole electronic device; and the one converted surface-mount electronic device is on the aluminum substrate through the conductive layer and the insulating layer; wherein the aluminum substrate is made of aluminum.