Aluminum Wire Polyimide Insulation Adhesion
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Solution Overview
Problem
Aluminum-based insulated wires face issues with poor adhesion between the conductor and insulating film, as well as reduced processing resistance due to oxidation and lower melting points compared to copper-based wires, limiting their use in miniaturized electronic devices.
Innovation Solution
A polyimide resin insulating film is applied to an aluminum conductor, composed of specific ratios of 3,3′,4,4′-biphenyl tetracarboxylic acid dianhydride, 3,3′,4,4′-benzophenone tetracarboxylic acid dianhydride, and pyromellitic anhydride reacted with 4,4′-diaminodiphenyl ether, providing excellent adhesion and environmental resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If aluminum conductor is used to reduce weight, then weight reduction is achieved, but adhesion between conductor and insulating film deteriorates
Solution Approach 1:
The patent changes the chemical composition parameters of the polyimide resin by controlling the molar ratios of specific acid components (3,3′,4,4′-biphenyl tetracarboxylic acid dianhydride, 3,3′,4,4′-benzophenone tetracarboxylic acid dianhydride, and pyromellitic anhydride) to optimize adhesion to aluminum conductor while maintaining the weight reduction benefit of using aluminum instead of copper
Solution Approach 2:
The patent creates a composite material system consisting of aluminum conductor combined with a specifically formulated polyimide resin insulating film, where the composite achieves both light weight and excellent adhesion through the optimized resin composition
2Weight of moving object
If aluminum conductor is used instead of copper, then weight reduction is achieved, but processing resistance deteriorates
Solution Approach 1:
The patent optimizes the chemical composition parameters of the polyimide resin, specifically controlling the content of pyromellitic anhydride and other acid components, to enhance processing resistance of the insulating film on aluminum conductor, thereby improving ease of manufacture while maintaining weight reduction
3Weight of moving object
If aluminum conductor is used, then weight reduction is achieved, but oxidation resistance worsens
Solution Approach 1:
The patent forms a composite protective structure where the optimized polyimide resin insulating film serves as a protective layer on the aluminum conductor, providing oxidation resistance while the aluminum core maintains the weight reduction advantage
Solution Approach 2:
The patent modifies the chemical composition of the polyimide resin by adjusting the ratios of aromatic acid components to enhance the chemical stability and oxidation resistance of the insulating film, thereby protecting the aluminum conductor from oxidation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances adhesion and processing resistance of the insulating film on aluminum conductors, maintaining performance even under thermal degradation, and supports miniaturization of coils while offering excellent insulating, electric, and mechanical properties.
Implementation Method 1
a first insulating film provided on the aluminum conductor. The first insulating film is made of a first polyimide obtained by reacting an acid component containing 50 mol % to 90 mol % of 3,3′,4,4′-biphenyl tetracarboxylic acid dianhydride, 5 mol % to 20 mol % of 3,3′,4,4′-benzophenone tetracarboxylic acid dianhydride, and 5 mol % to 40 mol % of pyromellitic anhydride with a diamine component containing 4,4′-diaminodiphenyl ether
Data Source
AI summary
According to one embodiment, an insulated wire is disclosed. The insulated wire includes an aluminum conductor, and a first insulating film provided on the aluminum conductor. The first insulating film is made of a first polyimide obtained by reacting an acid component containing 50 mol % to 90 mol % of 3,3′,4,4′-biphenyl tetracarboxylic acid dianhydride, 5 mol % to 20 mol % of 3,3′,4,4′-benzophenone tetracarboxylic acid dianhydride, and 5 mol % to 40 mol % of pyromellitic anhydride with a diamine component containing 4,4′-diaminodiphenyl ether.