Alumite Layer Ceramic Coating for LED Substrate Ion Migration
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Solution Overview
Problem
Existing electronic component mounting substrates for high heat-generating components like LED lamps face issues with ion migration and thermal conductivity degradation due to hygroscopicity and thermal expansion coefficient differences between resin and alumite layers.
Innovation Solution
A substrate comprising a metallic substrate with an alumite layer and a ceramic layer that covers the alumite layer, with the ceramic layer extending into crevices to reinforce the alumite layer and minimize moisture-induced deterioration, while maintaining high thermal conductivity and insulation performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If alumite layer and thermally-conductive resin insulating layer are combined, then thermal conductivity is improved, but separation occurs due to large difference in thermal expansion coefficient
Solution Approach 1:
The patent introduces ceramic particles locally within the resin layer to create zones with different thermal expansion characteristics. These ceramic-included regions act as transition zones that buffer the thermal expansion stress between the alumite layer and resin, preventing separation while maintaining thermal conductivity.
Solution Approach 2:
The composite structure of resin with embedded ceramic particles creates a material with intermediate thermal expansion properties between pure resin and alumite layer, reducing the thermal expansion coefficient mismatch and preventing layer separation under thermal cycling conditions.
2Reliability
If aluminum nitride substrate is used, then thermal conductivity is improved, but manufacturing cost increases
Solution Approach 1:
The patent replaces the expensive aluminum nitride substrate with a more economical aluminum substrate combined with an alumite layer and ceramic-enhanced resin layer. This substitution uses cheaper materials that can achieve comparable thermal conductivity performance, thereby reducing manufacturing cost while maintaining functionality.
Solution Approach 2:
The patent creates a composite thermal management structure using aluminum substrate with alumite coating and ceramic-containing resin, which provides cost-effective alternative to monolithic aluminum nitride while achieving similar thermal conductivity through the combined effect of multiple materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances resistance to ion migration and thermal conductivity, ensuring long-term performance and cost-effectiveness compared to traditional aluminum nitride substrates.
Implementation Method 1
an alumite layer 12, formed on the metallic substrate 11
Implementation Method 2
a ceramic layer 13 which covers the alumite layer 12 formed on the alumite layer 12
Data Source
Figure 1
Figure 2(a)~2(d)
Figure 3
AI summary
There is provided an electronic component mounting substrate which excels in resistance to migration, and is thus capable of maintaining high thermal conductivity and insulation performance for a long period of time. An electronic component mounting substrate (10) includes: a metallic substrate (11) formed of aluminum or an aluminum-based alloy; an alumite layer (12) disposed on the metallic substrate (11), having a network of crevices (22) at an upper surface (21) thereof; and a ceramic layer (13) disposed on the alumite layer (12), part of the ceramic layer (13) extending into the crevices (22).