Build Plane Induction Coil Sensing for In-Situ AM Flaw Detection
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Solution Overview
Problem
Current additive manufacturing (AM) methods lack effective in-situ monitoring techniques to detect internal flaws during the build process, leading to wasted time and material due to the inability to identify and classify internal defects before the final structure is completed.
Innovation Solution
A non-destructive inspection system utilizing a build plane induction coil sensor with coplanar magnetization and sensor coils, coupled with complex impedance plane analysis, to monitor and analyze the impedance characteristics of AM build parts in real-time, allowing for the identification of anomalies and adjustments during the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional inspection methods (thermal imaging, visual monitoring) are used for in-situ monitoring, then surface layer inspection is achieved, but internal flaw detection capability is insufficient
Solution Approach 1:
The patent replaces traditional mechanical/optical inspection methods (thermal imaging, visual monitoring) with electromagnetic induction-based inspection. The build plane induction coil sensor uses electromagnetic fields to detect internal flaws through impedance changes, enabling subsurface defect detection without mechanical contact or complex optical systems.
Solution Approach 2:
The patent introduces an electromagnetic field as an intermediary between the inspection system and the build part. The magnetization coil generates an electromagnetic field that penetrates the build material, and the sensor coil detects impedance changes caused by internal flaws, serving as an indirect detection mechanism that overcomes the limitations of direct surface inspection.
2Loss of time
If inspection is performed only after build completion, then comprehensive flaw identification is achieved, but time and material are wasted due to undetected early-stage flaws
Solution Approach 1:
The patent performs inspection actions during the build process itself rather than after completion. The build plane induction coil sensor monitors each layer as it is deposited, enabling early detection of flaws before they propagate or compromise the entire structure, thus preventing waste of time and material on defective builds.
Solution Approach 2:
The patent implements continuous inspection throughout the additive manufacturing process. Instead of discrete post-build inspection, the system continuously monitors the build part layer-by-layer during fabrication, maintaining uninterrupted detection capability that ensures flaws are identified at the earliest possible moment without stopping the build process.
3Loss of information
If in-situ monitoring is implemented during the build process, then real-time flaw detection is achieved, but the ability to detect subsurface/internal flaws is limited
Solution Approach 1:
The patent transitions from surface-level (2D) inspection to subsurface (3D) inspection by utilizing electromagnetic field penetration. The induction coil sensor detects impedance changes that originate from internal flaws beneath the surface, adding a depth dimension to the inspection capability that goes beyond traditional surface-only monitoring methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate in-situ detection of internal flaws and anomalies, facilitating real-time process adjustments and improving the quality control of AM parts by providing a closed-loop control mechanism for additive manufacturing processes.
Implementation Method 1
The magnetization coil is configured to induce currents within the build part
Implementation Method 2
the sensor coil is configured to capture impedance data from the build part
Data Source
AI summary
An inspection system for in situ evaluation of an additive manufacturing (AM) build part is provided. The inspection system comprises a build plane induction coil sensor configured and positionable so that during construction of the build part, the sensor's magnetization and sensor coils surround at least the last-produced layer of the AM build part in the build plane. The inspection system further comprises an energization circuit and a central processing system. The central processing system comprises a communication processor configured for sending command signals to the energization circuit and receiving impedance data from the build plane induction coil sensor, and energization controller configured for determining energization commands for transmission to the energization circuit, and an induction data analyzer configured for processing build part impedance data using complex impedance plane analysis and for identifying anomalies in the AM build part.