Ambient-Temperature Electronic Sticker Assembly

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Solution Overview

Problem

Existing electronic sticker technologies require special tools and elevated temperatures for assembly, limiting their application to non-flat surfaces and making them incompatible with materials that melt or burn, and they are often disposable and not reusable.

Innovation Solution

The use of anisotropic conductive tape films bonded to a flexible polyimide substrate allows for ambient temperature assembly without soldering or special tools, enabling flexible and reusable electronic stickers that can be applied to curved surfaces and support complex circuit integration with re-usable modules.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If elevated temperatures and special tools are used for assembly, then circuit assembly is achieved, but material compatibility deteriorates and application flexibility is limited

Engineering Contradiction:

Improvecircuit assemblyVSAvoidmaterial compatibility

Core Design Contradiction:

Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The patent changes the temperature parameter from elevated temperatures to ambient temperature for the assembly process. The anisotropic conductive adhesive enables bonding at ambient temperature, eliminating the need for elevated temperature processing and thereby preventing damage to heat-sensitive materials while achieving reliable circuit assembly.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent replaces traditional mechanical assembly methods (soldering, welding, high-temperature bonding) with a pressure-sensitive adhesive system. The anisotropic conductive adhesive panel bonds circuit elements through simple pressure application without requiring special tools or elevated temperatures, enabling assembly of heat-sensitive materials.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If traditional assembly methods are used, then circuit bonding is achieved, but reusability is lost

Engineering Contradiction:

Improvecircuit bondingVSAvoidreusability

Core Design Contradiction:

ReliabilityVSEase of repair

Solution Approach 1:

The patent introduces a reusable electronic sticker system where the anisotropic conductive adhesive panel can be repeatedly applied and removed without losing its bonding capability. The adhesive maintains its effectiveness through multiple use cycles, enabling the electronic sticker to be reused for different applications while maintaining reliable circuit bonding each time.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The patent enables recovery and reuse of the electronic sticker assembly. The anisotropic conductive adhesive panel can be removed from one substrate and applied to another, allowing the same circuit module to be reused multiple times. This recovers the value of the electronic components while maintaining reliable bonding through each reuse cycle.

Inventive Principle:

Principle #34Discarding and recovering

3Stability of the object's composition

If rigid substrates are used, then structural stability is achieved, but flexibility and applicability to curved surfaces is lost

Engineering Contradiction:

Improvestructural stabilityVSAvoidflexibility

Core Design Contradiction:

Stability of the object's compositionVSShape

Solution Approach 1:

The patent uses a flexible polyimide substrate for the electronic sticker, replacing rigid substrates. This flexible substrate can conform to curved and non-planar surfaces while maintaining structural integrity. The anisotropic conductive adhesive panel is also made flexible, enabling the entire assembly to be applied to various surface geometries without compromising structural stability.

Inventive Principle:

Principle #30Flexible shells and thin films

4Productivity

If conventional manufacturing techniques are used, then production efficiency is achieved, but adaptability to new materials and designs is limited

Engineering Contradiction:

Improveproduction efficiencyVSAvoiddesign flexibility

Core Design Contradiction:

ProductivityVSAdaptability or versatility

Solution Approach 1:

The patent uses pre-manufactured anisotropic conductive adhesive panels that are ready for immediate use. These panels can be die-cut into various shapes and sizes to match different circuit module configurations. The preliminary preparation of the adhesive panels enables quick assembly without requiring custom manufacturing processes for each design variation, maintaining high productivity while accommodating design flexibility.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables the assembly of circuits at ambient temperature without special tools, allowing for flexible application on various materials, including those that would melt or burn, and facilitates the creation of reusable electronic stickers with enhanced robustness and compatibility with conventional manufacturing techniques, supporting complex circuit integration and re-usability.

Implementation Method 1

The anisotropic conductive tape film conducts current through a thickness of the anisotropic conductive tape film but not through a width or length of the anisotropic conductive tape film

Methodology Applied

Scientific EffectAnisotropic conduction: Anisotropy

Implementation Method 2

The vacuum chuck has been machined with cavities to accommodate a profile on a first side of the flexible substrate. The vacuum chuck contains pins that pierce both the flexible substrate and the anisotropic adhesive panel

Methodology Applied

Scientific EffectVacuum pressure: Vacuum

Implementation Method 3

The roller applies a temperature of at least 30° C. and a pressure of at least 15 psi for a period of at least five seconds to affect the lamination process

Methodology Applied

Scientific EffectThermal bonding: Heating

Implementation Method 4

The roller applies a temperature of at least 30° C. and a pressure of at least 15 psi for a period of at least five seconds to affect the lamination process

Methodology Applied

Scientific EffectPressure bonding: Compression

Implementation Method 5

The anisotropic adhesive panel, the fully-assembled electronics circuit module, and the flexible substrate is held in an oven at approximately 40° C. for at least half an hour

Methodology Applied

Scientific EffectThermal curing: Heating