Ambient Temperature Determination Using Multi-Sensor Thermal Modeling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Accurate ambient temperature sensing within an enclosure is challenging due to temperature differences caused by heat generation, power consumption, ventilation, and air flow, leading to inaccuracies when using thermistors or semiconductor sensors.
Innovation Solution
A system using two or more temperature sensors within the enclosure to calculate ambient temperature by generating equations based on power dissipation, allowing for two-dimensional or three-dimensional modeling to account for varying heat conditions and air flow, without requiring special algorithms or time-dependent measurements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If temperature sensors are placed within the enclosure to sense temperature, then temperature measurement is enabled, but the measured temperature is higher than the ambient air temperature due to heat generation from device components
Solution Approach 1:
The patent transitions from direct temperature measurement (one-dimensional approach) to indirect temperature determination by measuring multiple parameters (temperature at different locations, power consumption, ventilation status) and using mathematical relationships to calculate ambient temperature. This multi-dimensional approach allows separation of device-generated heat effects from ambient temperature effects.
Solution Approach 2:
The patent introduces mathematical models and algorithms as intermediaries between the physical temperature sensors and the ambient temperature determination. By using multiple temperature sensors at different locations within the enclosure and applying thermal modeling, the system indirectly determines ambient temperature without directly measuring it, thereby eliminating the harmful effect of device heat generation on measurement accuracy.
2Measurement precision
If multiple temperature sensors are used to account for heat generation and air flow, then measurement precision improves, but device complexity increases
Solution Approach 1:
The patent makes the temperature sensing system multi-functional by using the same temperature sensors for multiple purposes: measuring device temperature for thermal management, characterizing heat generation patterns, detecting air flow effects, and determining ambient temperature. This universal use of sensors reduces the need for additional dedicated sensors and simplifies the overall system.
Solution Approach 2:
The system uses its own operational characteristics (power consumption, ventilation operation) to help determine ambient temperature. By monitoring how the device's own heat generation and cooling systems affect internal temperatures, the system can back-calculate ambient conditions without requiring external reference measurements or complex additional hardware.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise and instantaneous calculation of ambient temperature, independent of power consumption, effectively addressing the inaccuracies caused by heat generation and air flow variations, and can detect air flow direction and magnitude.
Implementation Method 1
temperature sensors from within an enclosure of electronics or equipment may result in a temperature higher than the ambient air temperature surrounding the enclosure
Implementation Method 2
air flow surrounding the enclosure and/or device
Data Source
AI summary
A mechanism for indicating ambient temperature of an enclosure from temperatures determined within the enclosure. The temperatures may be obtained from two or more sensors at each of two or more locations within the enclosure. The enclosure may include an apparatus inside such as electronics of which power consumption may be determined. Data including temperatures of two locations within the enclosure at various electronics power consumption levels may be entered into a 2-D plot. An approximation of the 2-D plot may be effected with an appropriate equation to be solved for ambient temperature. The data of the 2-D plot plus temperatures of a third location and air flow levels in the enclosure may be entered into a 3-D plot. An approximation of the 3-D plot may be effected with an appropriate equation to be solved for ambient temperature.