Ambient-Cooled Two-Phase Cooling for High-Heat-Flux Processors
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Solution Overview
Problem
Current cooling methods are inadequate for microprocessors with high heat flux and 3D chip stacks, as they fail to efficiently manage thermal resistance and energy consumption.
Innovation Solution
A two-phase cooling system with a primary and secondary loop, utilizing an evaporator, ambient cooled condenser, pumps, pressure regulators, and controllers to dynamically adjust coolant flow and pressure based on ambient conditions, along with a heat recovery system, to minimize energy consumption and thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air-cooled systems are used for microprocessors, then the system structure is simple, but the thermal resistance and energy consumption are high making them inadequate for high heat flux components
Solution Approach 1:
The cooling system is divided into two separate loops: a primary loop that directly contacts the microprocessor for high-heat-density cooling, and a secondary loop that handles condensation and ambient heat rejection. This segmentation allows each loop to be optimized for its specific function, achieving low thermal resistance while maintaining manageable system complexity through modular design
Solution Approach 2:
An ambient-cooled condenser acts as an intermediary between the primary cooling loop and the environment. It transfers heat from the vaporized coolant to ambient air without requiring the primary loop to directly interact with ambient conditions, enabling efficient heat rejection while maintaining system stability and low thermal resistance
2Use of energy by moving object
If traditional cooling methods are used, then the system is easy to operate, but energy consumption is high and cannot efficiently cool high heat density components
Solution Approach 1:
The system incorporates dynamic control mechanisms where the controller adjusts pump speeds and valve positions based on real-time temperature and heat load conditions. This dynamic operation optimizes energy consumption by matching cooling capacity to actual demand, reducing energy waste while maintaining ease of operation through automated control
Solution Approach 2:
The system utilizes phase transition of the coolant (liquid to vapor in evaporator, vapor to liquid in condenser) to efficiently transfer and reject heat. This phase-change mechanism enables high heat flux removal with lower energy consumption compared to conventional single-phase cooling, while the automated control of phase transition processes maintains operational simplicity
3Productivity
If two-phase cooling is implemented for high heat flux microprocessors, then cooling efficiency improves, but system complexity and control requirements increase
Solution Approach 1:
By segmenting the two-phase cooling system into distinct primary and secondary loops with dedicated components for evaporation and condensation, the patent achieves high cooling efficiency for high heat flux microprocessors while managing system complexity through functional separation and modular architecture
Solution Approach 2:
The ambient-cooled condenser serves multiple functions: it acts as a heat exchanger for the primary loop, provides ambient heat rejection, and enables year-round operation in various climates. This multi-functionality increases cooling efficiency while reducing overall system complexity by consolidating functions into single components
4Use of energy by stationary object
If ambient cooled condenser is used, then energy-intensive cooling is eliminated for year-round operation, but system adaptability to varying ambient conditions requires dynamic control
Solution Approach 1:
The system employs dynamic control mechanisms that automatically adjust pump speeds, valve positions, and flow rates in response to varying ambient conditions. This dynamic adaptation enables the ambient-cooled condenser to maintain optimal performance across different temperatures and climates, eliminating energy-intensive cooling while preserving adaptability through automated response to environmental changes
Solution Approach 2:
The controller receives feedback from temperature sensors and ambient condition monitors to continuously optimize system operation. This feedback mechanism enables the system to adapt to varying ambient conditions while maintaining energy efficiency, as the controller adjusts operational parameters based on real-time environmental data and cooling requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces thermal resistance and energy usage by up to 20 times compared to air-cooled systems, enabling efficient cooling of high heat density components and year-round data center operation without energy-intensive cooling.
Implementation Method 1
The evaporator cools high heat density components of the computer system by evaporation of the liquid coolant into a vaporized coolant
Implementation Method 2
evaporation of the liquid coolant into a vaporized coolant
Implementation Method 3
the ambient cooled condenser transfers heat released by condensation of the vaporized coolant to a secondary coolant
Implementation Method 4
a cooler that exchanges heat with an ambient external environment
Data Source
AI summary
An apparatus for cooling a computer system includes a primary cooling loop. The primary cooling loop includes an evaporator configured to cool at least a component of the computer system, an ambient cooled condenser connected to the evaporator, a first pump to provide a coolant flow within the cooling loop, a pressure regulator configured to maintain a selected pressure in the primary cooling loop, and a controller responsive to changes in outdoor ambient conditions and an amount of heat dissipated by the computer system and configured to dynamically adjust the pump and pressure regulator in response thereto.