Electrostatic Dissipation and Thermal Compensation for Autonomous Mobile Devices
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Solution Overview
Problem
Autonomous mobile devices (AMDs) face issues with electrostatic charges and thermal expansion, which can distort sensor positioning and reduce the accuracy of sensor data, and also cause discomfort and damage to sensors and electronics.
Innovation Solution
The implementation of an electrostatic dissipation structure and electrically conductive wheel assemblies connected to a chassis ground, along with elastomeric components to mitigate thermal expansion, providing a conductive path for electrostatic charges and reducing thermally induced strains.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrostatic dissipation structure and conductive wheel assemblies are implemented, then electrostatic charge dissipation is improved, but device complexity increases
Solution Approach 1:
The patent combines the electrostatic dissipation function with existing structural components. The wheel assemblies serve dual purposes: providing mobility and acting as electrostatic discharge paths to ground. The electrostatic dissipation structure is integrated into the device housing rather than being a separate component, thereby achieving electrostatic protection without proportionally increasing device complexity.
Solution Approach 2:
The device uses its own operational components (wheels that contact the ground during normal operation) to provide electrostatic dissipation. The wheel assemblies naturally serve as conductive paths to ground during device operation, eliminating the need for dedicated external grounding structures and reducing overall system complexity.
2Measurement precision
If elastomeric components are used to mitigate thermal expansion, then sensor positioning accuracy is improved, but device complexity increases
Solution Approach 1:
The patent addresses thermal expansion by changing the material parameter of the mounting components from rigid to elastomeric. The elastomeric components have thermal expansion characteristics that match or complement the sensor housing and sensor components, allowing them to expand and contract together with temperature changes, thereby maintaining precise sensor positioning without requiring complex active compensation mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively dissipates electrostatic charges and reduces thermal stresses, improving the accuracy and reliability of sensor data, enhancing user comfort, and ensuring the integrity of sensors and electronics.
Implementation Method 1
The electrostatic dissipation structure and the one or more electrically conductive wheel assemblies are part of a conductive path that dissipates electrostatic charges
Implementation Method 2
The electrostatic dissipation structure and the one or more electrically conductive wheel assemblies are part of a conductive path that dissipates electrostatic charges
Implementation Method 3
The heat may thermally expand or contract AMD support structures that are used to mount sensors
Implementation Method 4
elastomeric components to mitigate thermal expansion
Data Source
AI summary
An autonomous mobile device (AMD) builds up electrostatic charges from moving and generates heat from the operation of internal components. In addition to possible user discomfort, electrostatic discharges may damage sensors and electronics. Electrostatic charges are dissipated from the AMD using an electrostatic dissipation structure and conductive wheels. A conductive path between a chassis ground, the electrostatic dissipation structure, and the conductive wheels improves the dissipation of electrostatic charges. Electrostatic charges are also dissipated from components by mounting the components using conductive materials. Sensors may be affixed to a support structure that is affected by thermal expansion. Thermal expansion may distort precise positioning of sensors, reducing accuracy of sensor data. An elastomeric foam may be used to mount sensors to a support structure, allowing for thermal expansion without distorting the positioning of the sensors.