Amide Polymerizable Composition for Hard, Stable UV-Cured Films
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Solution Overview
Problem
Existing amide compounds do not possess sufficient physical properties, limiting their effectiveness in applications such as UV inks and coatings.
Innovation Solution
Development of an amide compound represented by Formula (5) with specific substituent groups and valences, which when polymerized with a polymerization initiator, forms a cured material with improved physical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional amide compounds are used, then the compound structure is simple, but the physical properties (solubility, compatibility, film hardness) are insufficient
Solution Approach 1:
The patent applies parameter changes by systematically varying the hydrocarbon group chain lengths (n1, n2, n3, n4) and substituent types in the amide compound structure. By changing these parameters, the invention optimizes solubility, compatibility, and film hardness properties while maintaining a manageable molecular structure through defined constraints on the parameter ranges.
Solution Approach 2:
The patent employs composite material principles by combining multiple functional groups (amide group, hydroxyl group, carboxyl group, and various hydrocarbon chains) into a single molecular structure. This composite approach allows the molecule to exhibit multiple desirable properties simultaneously - solubility from hydroxyl/carboxyl groups, structural stability from the amide bond, and tunable physical properties from the hydrocarbon chains.
2Ease of manufacture
If the amide compound structure is simplified, then the compound is easier to manufacture, but the storage stability and adherence properties deteriorate
Solution Approach 1:
The patent uses parameter changes to optimize the balance between manufacturability and performance. By constraining the chain length parameters (n1-n4) to specific ranges (0-5) and defining specific valence requirements, the invention ensures that compounds remain synthetically accessible while achieving the necessary storage stability and adherence properties through optimized molecular architecture.
3Reliability
If the amide compound has higher functionality, then the cured material properties improve, but the synthesis complexity increases
Solution Approach 1:
The patent applies local quality by concentrating multiple functional groups (amide, hydroxyl, carboxyl) at specific positions within the molecular structure rather than distributing them uniformly. This allows the compound to achieve high functionality for improved cured material properties while maintaining a structured, manageable synthesis pathway by localizing the complexity to specific functional regions of the molecule.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The amide compound achieves superior solubility, compatibility, and film hardness, enhancing storage stability and adherence to bases.
Implementation Method 1
A polymerizable composition includes an amide compound represented by Formula (1) and a polymerization initiator
Data Source
AI summary
A polymerizable composition includes an amide compound represented by Formula (1) and a polymerization initiator.